Assignee
FURUKAWA CIRCUIT FOIL
JP·14 granted patents·4 pending applications·180 citations·filing 1980–2006
Top patents by PatentIndex Score
18 records- 0191US7381475B2Treated copper foil and circuit boardFURUKAWA CIRCUIT FOIL·Filed 2005·Granted Jun 3, 2008·22 cites·14 claims
- 0286US4376154ACopper foil for a printed circuit and a method for the production thereofFURUKAWA CIRCUIT FOIL·Filed 1980·Granted Mar 8, 1983·27 cites·17 claims
- 0379US4935310ACopper foil for a printed circuit and a method for the production thereofFURUKAWA CIRCUIT FOIL·Filed 1989·Granted Jun 19, 1990·26 cites·4 claims
- 0471US4386139ACopper foil for a printed circuit and a method for the production thereofFURUKAWA CIRCUIT FOIL·Filed 1980·Granted May 31, 1983·23 cites·14 claims
- 0568US4483906ACopper foil for a printed circuit and a method for the production thereofFURUKAWA CIRCUIT FOIL·Filed 1983·Granted Nov 20, 1984·14 cites·2 claims
- 0666US4778571AMethod of making electrolytic metal foil and apparatus used thereforFURUKAWA CIRCUIT FOIL·Filed 1987·Granted Oct 18, 1988·15 cites·6 claims
- 0764US7215235B2Conductive substrate with resistance layer, resistance board, and resistance circuit boardFURUKAWA CIRCUIT FOIL·Filed 2004·Granted May 8, 2007·6 cites·10 claims
- 0860US6939622B2Chip-on-film use copper foilFURUKAWA CIRCUIT FOIL·Filed 2004·Granted Sep 6, 2005·11 cites·4 claims
- 0960US4964965AInsoluble electrode device for treatment of metallic materialFURUKAWA CIRCUIT FOIL·Filed 1990·Granted Oct 23, 1990·15 cites·17 claims
- 1057US7172818B2Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit boardFURUKAWA CIRCUIT FOIL·Filed 2003·Granted Feb 6, 2007·8 cites·7 claims
- 1146US7476449B2Electromagnetic shielding copper foil, method of production thereof and electromagnetic shieldFURUKAWA CIRCUIT FOIL·Filed 2004·Granted Jan 13, 2009·0 cites·12 claims
- 1246US7052779B2Copper foil for fine pattern printed circuits and method of production of sameFURUKAWA CIRCUIT FOIL·Filed 2004·Granted May 30, 2006·3 cites·8 claims
- 1345US4976826AMethod of making electrodeposited copper foilFURUKAWA CIRCUIT FOIL·Filed 1990·Granted Dec 11, 1990·10 cites·11 claims
- 1444US2004029006A1Electrodeposited copper foil and electrodeposited copper foil for secondary battery collectorFURUKAWA CIRCUIT FOIL·Filed 2003·Application pending·0 cites
- 1543US2005158574A1Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrierFURUKAWA CIRCUIT FOIL·Filed 2004·Application pending·0 cites
- 1643US2004154930A1Copper foil for high frequency circuit and method of production of sameFURUKAWA CIRCUIT FOIL·Filed 2004·Application pending·0 cites
- 1736US2007042212A1Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFURUKAWA CIRCUIT FOIL·Filed 2006·Application pending·0 cites
- 1811US5135631AElectrodeposition drumFURUKAWA CIRCUIT FOIL·Filed 1991·Granted Aug 4, 1992·0 cites·1 claims
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