Assignee
KAIJO KK
JP66 patents
Top patents by PatentIndex Score
US6933608B2Aug 23, 2005
Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
KAIJO KK144 citations96
US7262124B2Aug 28, 2007
Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
KAIJO KK118 citations95
US6216364B1Apr 17, 2001
Method and apparatus for drying washed objects
KAIJO KK100 citations94
US5810155ASep 22, 1998
Object levitating apparatus object transporting apparatus and object levitating bearing along with an object levitating process and object transporting process
KAIJO KK82 citations94
US6455982B1Sep 24, 2002
Object levitating apparatus, an object transporting apparatus equipped with said apparatus, and an object levitating process
KAIJO KK24 citations93
US5566876AOct 22, 1996
Wire bonder and wire bonding method
KAIJO KK83 citations93
US6241162B1Jun 5, 2001
Ultrasonic shower cleaning apparatus
KAIJO KK25 citations92
US5749698AMay 12, 1998
Substrate transport apparatus and substrate transport path adjustment method
KAIJO KK26 citations92
US5699951ADec 23, 1997
Wire bonder and a bonding tool and bonding arm
KAIJO KK44 citations92
US5685476ANov 11, 1997
Wire guiding apparatus, wire guiding method and a wire bonder equipped with said apparatus
KAIJO KK22 citations92
US6901685B2Jun 7, 2005
Method for drying washed objects
KAIJO KK17 citations91
US5890580AApr 6, 1999
Object levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting process
KAIJO KK26 citations91
US5474224ADec 12, 1995
Wire bonder and wire bonding method
KAIJO KK27 citations90
US5458280AOct 17, 1995
Wire bonder and wire bonding method
KAIJO KK21 citations90
US7815095B2Oct 19, 2010
Wire loop, semiconductor device having same and wire bonding method
KAIJO KK35 citations89
US5238173AAug 24, 1993
Wire bonding misattachment detection apparatus and that detection method in a wire bonder
KAIJO KK83 citations86
US6715666B2Apr 6, 2004
Wire bonding method, method of forming bump and bump
KAIJO KK38 citations85
US5628605AMay 13, 1997
Substrate transport apparatus and substrate transport path adjustment method
KAIJO KK14 citations81
US7748599B2Jul 6, 2010
Wire bonding method, wire bonding apparatus, and wire bonding control program
KAIJO KK8 citations78
USD867610SNov 19, 2019
Ultrasonic cleaner
KAIJO KK6 citations76
US5853284ADec 29, 1998
Notched wafer aligning apparatus
KAIJO KK19 citations74
US5222648AJun 29, 1993
Bonder
KAIJO KK14 citations74
US8016182B2Sep 13, 2011
Wire loop, semiconductor device having same and wire bonding method
KAIJO KK8 citations73
US5634765AJun 3, 1997
Substrate transport apparatus and substrate transport path adjustment method
KAIJO KK9 citations73
US5562382AOct 8, 1996
Substrate transport apparatus and substrate transport path adjustment method
KAIJO KK7 citations73
USD889593SJul 7, 2020
Ultrasonic transducer
KAIJO KK3 citations72
US10600754B2Mar 24, 2020
Bonding method
KAIJO KK2 citations72
US6779534B2Aug 24, 2004
Apparatus and method for drying washed objects
KAIJO KK10 citations72
US5456403AOct 10, 1995
Wire bonder and wire bonding method
KAIJO KK17 citations71
US9772012B2Sep 26, 2017
Drive mechanism and manufacturing device
KAIJO KK2 citations68
US9865562B2Jan 9, 2018
Bonding device
KAIJO KK2 citations67
US7726325B2Jun 1, 2010
Deaeration device and ultrasonic cleaning device using the same
KAIJO KK7 citations67
USD381344SJul 22, 1997
Disk carrier
KAIJO KK11 citations66
US5156320AOct 20, 1992
Wire bonder and wire bonding method
KAIJO KK18 citations66
US6921193B2Jul 26, 2005
Chemical concentration control device for semiconductor processing apparatus
KAIJO KK5 citations63
US5180094AJan 19, 1993
Wire bonder with bonding arm angle sensor
KAIJO KK14 citations63
US11404393B2Aug 2, 2022
Wire bonding method and wire bonding device
KAIJO KK0 citations62
US7392812B2Jul 1, 2008
Substrate processing apparatus and substrate transporting device mounted thereto
KAIJO KK7 citations62
US10262969B2Apr 16, 2019
Bonding device
KAIJO KK1 citations57
US7899239B2Mar 1, 2011
Inspection method of bonded status of ball in wire bonding
KAIJO KK4 citations57
US7191929B2Mar 20, 2007
Method of measuring thickness of bonded ball in wire bonding
KAIJO KK5 citations57
US6325865B2Dec 4, 2001
Method for drying substrate
KAIJO KK2 citations55
US6244281B1Jun 12, 2001
Method and apparatus for drying substrate
KAIJO KK5 citations55
US7975899B2Jul 12, 2011
Work clamp and wire bonding apparatus
KAIJO KK4 citations54
US11302667B2Apr 12, 2022
Method of vertically vibrating a bonding arm
KAIJO KK0 citations53
US11791304B2Oct 17, 2023
Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus
KAIJO KK0 citations51
US11273515B2Mar 15, 2022
Bonding process with rotating bonding stage
KAIJO KK0 citations51
US11173567B2Nov 16, 2021
Bonding apparatus with rotating bonding stage
KAIJO KK0 citations51
US11154914B2Oct 26, 2021
Ultrasonic transducer and ultrasonic cleaning device using ultrasonic transducer
KAIJO KK0 citations51
US11148355B2Oct 19, 2021
Three-dimensional shaped object production device and three-dimensional shaped object production method
KAIJO KK0 citations51
Showing the top 50 of 66 patents by PatentIndex Score.