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TECHNIC
US49 patents
Top patents by PatentIndex Score
US6197182B1Mar 6, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC110 citations98
US6251238B1Jun 26, 2001
Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
TECHNIC76 citations96
US6296753B1Oct 2, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC17 citations92
US6132583AOct 17, 2000
Shielding method and apparatus for use in electroplating process
TECHNIC22 citations92
US6524463B2Feb 25, 2003
Method of processing wafers and other planar articles within a processing cell
TECHNIC30 citations91
US4534843AAug 13, 1985
Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
TECHNIC92 citations91
US6183619B1Feb 6, 2001
Metal alloy sulfonic acid electroplating baths
TECHNIC29 citations90
US5277790AJan 11, 1994
Non-cyanide electroplating solution for gold or alloys thereof
TECHNIC38 citations90
US4673472AJun 16, 1987
Method and electroplating solution for deposition of palladium or alloys thereof
TECHNIC49 citations90
US4585539AApr 29, 1986
Electrolytic reactor
TECHNIC83 citations90
US4406755ASep 27, 1983
Bright palladium electrodeposition
TECHNIC35 citations90
US5755954AMay 26, 1998
Method of monitoring constituents in electroless plating baths
TECHNIC35 citations88
US4246077AJan 20, 1981
Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
TECHNIC48 citations88
US4126524ANov 21, 1978
Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
TECHNIC48 citations88
US5110423AMay 5, 1992
Bath for electroplating bright tin or tin-lead alloys and method thereof
TECHNIC33 citations87
US6860981B2Mar 1, 2005
Minimizing whisker growth in tin electrodeposits
TECHNIC34 citations85
US7270733B2Sep 18, 2007
Method and apparatus for real time monitoring of industrial electrolytes
TECHNIC29 citations84
US5296128AMar 22, 1994
Gallic acid as a combination antioxidant, grain refiner, selective precipitant, and selective coordination ligand, in plating formulations
TECHNIC26 citations84
US6299751B1Oct 9, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC11 citations81
US5935306AAug 10, 1999
Electroless gold plating bath
TECHNIC19 citations80
US4278514AJul 14, 1981
Bright palladium electrodeposition solution
TECHNIC28 citations80
US4049508ASep 20, 1977
Tin-nickel plating
TECHNIC26 citations80
US7270734B1Sep 18, 2007
Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating
TECHNIC13 citations78
US4981564AJan 1, 1991
Additives for electroplating compositions and methods for their use
TECHNIC21 citations78
US7124120B2Oct 17, 2006
Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
TECHNIC14 citations77
US6287443B1Sep 11, 2001
Apparatus and method for electroplating wafers, substrates and other articles
TECHNIC2 citations73
US6277260B1Aug 21, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC4 citations73
US6274023B1Aug 14, 2001
Apparatus and method for electroplating wafers, substrates and other articles
TECHNIC3 citations73
US6274024B1Aug 14, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC5 citations73
US6558750B2May 6, 2003
Method of processing and plating planar articles
TECHNIC12 citations72
US6562220B2May 13, 2003
Metal alloy sulfate electroplating baths
TECHNIC7 citations71
US6251253B1Jun 26, 2001
Metal alloy sulfate electroplating baths
TECHNIC12 citations71
US4186064AJan 29, 1980
Method and electrolyte for electrodeposition of bright gold and gold alloys
TECHNIC11 citations71
US5130168AJul 14, 1992
Electroless gold plating bath and method of using same
TECHNIC16 citations70
US4923576AMay 8, 1990
Additives for electroplating compositions and methods for their use
TECHNIC17 citations70
US4508611AApr 2, 1985
Apparatus for electroplating and chemically treating the contact elements of encapsulated electronic components and like devices
TECHNIC13 citations69
US5282953AFeb 1, 1994
Polyoxyalklene compounds terminated with ketone groups for use as surfactants in alkanesulfonic acid based solder plating baths
TECHNIC16 citations68
US6264806B1Jul 24, 2001
Plating fluid replenishment system and method
TECHNIC13 citations66
US5338343AAug 16, 1994
Catalytic electroless gold plating baths
TECHNIC16 citations65
US6419805B1Jul 16, 2002
Apparatus for plating wafers, substrates and other articles
TECHNIC1 citations62
US6267862B1Jul 31, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC1 citations62
US7208073B1Apr 24, 2007
Media for use in plating electronic components
TECHNIC5 citations60
US6179985B1Jan 30, 2001
Metal alloy fluoroborate electroplating baths
TECHNIC2 citations60
US6982030B2Jan 3, 2006
Reduction of surface oxidation during electroplating
TECHNIC3 citations59
US6361669B1Mar 26, 2002
Apparatus and method for plating wafers, substrates and other articles
TECHNIC0 citations51
US6322313B1Nov 27, 2001
Apparatus and method for inserting a wafer, substrate or other article into a process module
TECHNIC1 citations51
US7279086B2Oct 9, 2007
Electroplating solution for alloys of gold with tin
TECHNIC0 citations39
US7431817B2Oct 7, 2008
Electroplating solution for gold-tin eutectic alloy
TECHNIC0 citations38
US9864345B2Jan 9, 2018
Eliminating temperature variation effects to improve accuracy of electroplating bath monitoring
TECHNIC0 citations32