Assignee
WANG MENG-JEN
TW·13 granted patents·3 pending applications·79 citations·filing 2006–2013
Top patents by PatentIndex Score
16 records- 0197US8786098B2Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the sameWANG MENG-JEN·Filed 2011·Granted Jul 22, 2014·42 cites·18 claims
- 0293US8310063B2Semiconductor package structure and manufacturing process thereofWANG MENG-JEN·Filed 2010·Granted Nov 13, 2012·19 cites·12 claims
- 0383US8072081B2Microelectromechanical system packageWANG MENG JEN·Filed 2008·Granted Dec 6, 2011·9 cites·20 claims
- 0478US8415807B2Semiconductor structure and method for making the sameWANG MENG-JEN·Filed 2010·Granted Apr 9, 2013·4 cites·20 claims
- 0572US8692362B2Semiconductor structure having conductive vias and method for manufacturing the sameWANG MENG-JEN·Filed 2011·Granted Apr 8, 2014·3 cites·15 claims
- 0665US8338235B2Package process of stacked type semiconductor device package structureWANG MENG-JEN·Filed 2010·Granted Dec 25, 2012·2 cites·8 claims
- 0752US2009321916A1Semiconductor structure, method for manufacturing semiconductor structure and semiconductor packageWANG MENG-JEN·Filed 2009·Application pending·0 cites
- 0851US8778791B2Semiconductor structure and method for making the sameWANG MENG-JEN·Filed 2013·Granted Jul 15, 2014·0 cites·12 claims
- 0951US8673774B2Method for forming a via in a substrateWANG MENG-JEN·Filed 2011·Granted Mar 18, 2014·0 cites·20 claims
- 1050US8937015B2Method for forming vias in a substrateWANG MENG-JEN·Filed 2011·Granted Jan 20, 2015·0 cites·16 claims
- 1150US8471156B2Method for forming a via in a substrate and substrate with a viaWANG MENG-JEN·Filed 2009·Granted Jun 25, 2013·0 cites·18 claims
- 1249US8524602B2Method for forming vias in a substrateWANG MENG-JEN·Filed 2010·Granted Sep 3, 2013·0 cites·20 claims
- 1346US2010327442A1Package and the Method for Making the Same, and a Stacked PackageWANG MENG-JEN·Filed 2010·Application pending·0 cites
- 1443US8546255B2Method for forming vias in a semiconductor substrate and a semiconductor device having the semiconductor substrateWANG MENG-JEN·Filed 2010·Granted Oct 1, 2013·0 cites·30 claims
- 1542US2007252261A1Semiconductor device packageWANG MENG-JEN·Filed 2006·Application pending·0 cites
- 1639US8691625B2Method for making a chip packageWANG MENG-JEN·Filed 2010·Granted Apr 8, 2014·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →