Assignee
EOM YONG SUNG
KR·2 granted patents·2 pending applications·10 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0181US8211745B2Method and structure for bonding flip chipEOM YONG SUNG·Filed 2010·Granted Jul 3, 2012·7 cites·20 claims
- 0266US8420722B2Composition and methods of forming solder bump and flip chip using the sameEOM YONG SUNG·Filed 2009·Granted Apr 16, 2013·3 cites·10 claims
- 0358US2013146342A1Pattern-forming composition and pattern-forming method using the sameEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 0443US2012240727A1Method of manufacturing solder powder having diameter of sub-micrometers or several micrometersEOM YONG SUNG·Filed 2012·Application pending·0 cites
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