Pattern-forming composition and pattern-forming method using the same

Abstract

The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.

1 . A pattern-forming composition comprising:
 Cu powders;   a solder for electrically coupling the Cu powders;   a polymer resin;   a curing agent; and   a reductant.   
     
     
         2 . The pattern-forming composition as claimed in  claim 1 , wherein the diameter of the Cu powder is 2-10 μm. 
     
     
         3 . The pattern-forming composition as claimed in  claim 1 , wherein the solder is at least two selected from the group consisting of Sn, Bi, In, Ag, Pb and Cu. 
     
     
         4 . The pattern-forming composition as claimed in  claim 1 , wherein the solder is selected from the group consisting of a mixture of Sn and Bi, a mixture of In and Sn, a mixture of In and Ag, a mixture of Bi, Sn and Ag, a mixture of Bi and Sn, a mixture of Bi, Pb and Sn, and a mixture of Sn, Ag and Cu. 
     
     
         5 . The pattern-forming composition as claimed in  claim 1 , wherein the polymer resin is selected from the group consisting of diglycidyl ether of bisphenol A, tetraglycidyl 4,4′-diaminodiphenyl methane, tri diaminodiphenyl methane, isocyanate; and bismaleimide. 
     
     
         6 . The pattern-forming composition as claimed in  claim 1 , comprising 30-50 wt % of the Cu powder, 30-50 wt % of the solder, 1-20 wt % of the polymer resin, 1-15 wt % of the curing agent and 0.1-5 wt % of the reductant based on 100 wt % of the pattern-forming composition. 
     
     
         7 . The pattern-forming composition as claimed in  claim 1 , further comprising Ag powders. 
     
     
         8 . A pattern-forming method comprising the steps of:
 preparing a pattern-forming composition comprising Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant; and   forming a circuit pattern by printing the pattern-forming composition on the substrate.   
     
     
         9 . The pattern-forming method as claimed in  claim 8 , further comprising the step of electrolytic-plating the formed circuit pattern. 
     
     
         10 . The pattern-forming method as claimed in  claim 8 , wherein the diameter of the Cu powder is 2-10 μm. 
     
     
         11 . The pattern-forming method as claimed in  claim 8 , wherein the solder is at least two selected from the group consisting of Sn, Bi, In, Ag, Pb and Cu. 
     
     
         12 . The pattern-forming method as claimed in  claim 8 , wherein the solder is selected from the group consisting of a mixture of Sn and Bi, a mixture of In and Sn, a mixture of In and Ag, a mixture of Bi, Sn and Ag, a mixture of Bi and Sn, a mixture of Bi, Pb and Sn, and a mixture of Sn, Ag and Cu. 
     
     
         13 . The pattern-forming method as claimed in  claim 8 , wherein the pattern-forming composition further comprises Ag powders. 
     
     
         14 . A conductive circuit pattern formed by the method defined in  claim 8 . 
     
     
         15 . The conductive circuit pattern as claimed in  claim 14 , wherein the method further comprising the step of electrolytic-plating the formed circuit pattern. 
     
     
         16 . The conductive circuit pattern as claimed in  claim 14 , wherein the diameter of the Cu powder is 2-10 μm. 
     
     
         17 . The conductive circuit pattern as claimed in  claim 14 , wherein the solder is at least two selected from the group consisting of Sn, Bi, In, Ag, Pb and Cu. 
     
     
         18 . The conductive circuit pattern as claimed in  claim 14 , wherein the solder is selected from the group consisting of a mixture of Sn and Bi, a mixture of In and Sn, a mixture of In and Ag, a mixture of Bi, Sn and Ag, a mixture of Bi and Sn, a mixture of Bi, Pb and Sn, and a mixture of Sn, Ag and Cu. 
     
     
         19 . The conductive circuit pattern as claimed in  claim 14 , wherein the pattern-forming composition further comprises Ag powders.