Inventor · disambiguated record
Hyun Cheol Bae
Also filed as: BAE HYUN-CHEOL
25 granted patents·23 pending applications·133 citations·filing 2002–2021
95Inventor score
Files withKOREA ELECTRONICS TELECOMM17ELECTRONICS & TELECOMMUNICATIONS RES INST9HYUNDAI MOTOR CO LTD6BAE HYUN CHEOL3JI SANG WOO3
Top patents by PatentIndex Score
48 records- 0194US8610401B2Telematics device for remote charging control and method of providing service thereofKIM SUNG YUN·Filed 2010·Granted Dec 17, 2013·33 cites·15 claims
- 0289US7115459B2Method of fabricating SiGe Bi-CMOS deviceKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Oct 3, 2006·18 cites·10 claims
- 0388US10636761B2Method of fabricating a semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Apr 28, 2020·6 cites·11 claims
- 0486US9172635B2Ethernet backbone network system for vehicle and method for controlling fail safe of the ethernet backbone network systemHYUNDAI MOTOR CO LTD·Filed 2013·Granted Oct 27, 2015·10 cites·7 claims
- 0583US9853010B2Method of fabricating a semiconductor packageELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE·Filed 2015·Granted Dec 26, 2017·7 cites·15 claims
- 0677US7303966B2Semiconductor device and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2006·Granted Dec 4, 2007·5 cites·12 claims
- 0776US8030200B2Method for fabricating a semiconductor packageKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 4, 2011·6 cites·14 claims
- 0874US7550796B2Germanium semiconductor device and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2007·Granted Jun 23, 2009·4 cites·18 claims
- 0972US10033546B2Method and system for reprogrammingHYUNDAI MOTOR CO LTD·Filed 2013·Granted Jul 24, 2018·4 cites·9 claims
- 1072US9432207B2System and method for transferring message in ethernet based vehicle networkHYUNDAI MOTOR CO LTD·Filed 2013·Granted Aug 30, 2016·3 cites·13 claims
- 1171US6652289B2Vehicle door connector structureHYUNDAI MOTOR CO LTD·Filed 2002·Granted Nov 25, 2003·18 cites·10 claims
- 1269US8044757B2Electronic device including LTCC inductorKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 25, 2011·4 cites·10 claims
- 1366US7666749B2SiGe semiconductor device and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2007·Granted Feb 23, 2010·3 cites·9 claims
- 1465US8754784B2System for providing parking information based on dual wireless communication and method thereofJI SANG WOO·Filed 2011·Granted Jun 17, 2014·5 cites·11 claims
- 1562US9123548B1Semiconductor device and method of fabricating the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Granted Sep 1, 2015·1 cites·18 claims
- 1661US2021358885A1Laser bonding method and a semiconductor package including a bonding part and a bonding targetELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 1759US9980393B2Pattern-forming method for forming a conductive circuit patternELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted May 22, 2018·0 cites·15 claims
- 1859US9538666B2Bonding structure of electronic equipmentELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Jan 3, 2017·1 cites·15 claims
- 1959US9231967B2Apparatus and method for detecting in-vehicle network attackHYUNDAI MOTOR CO LTD·Filed 2013·Granted Jan 5, 2016·1 cites·10 claims
- 2058US2013146342A1Pattern-forming composition and pattern-forming method using the sameEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 2157US11107790B2Laser bonding methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Aug 31, 2021·0 cites·15 claims
- 2257US8711003B2Vehicle location information-based abnormal driving determination and warning systemYU TAE YOUNG·Filed 2011·Granted Apr 29, 2014·3 cites·22 claims
- 2356US8723292B2Silicon interposer including backside inductorBAE HYUN-CHEOL·Filed 2012·Granted May 13, 2014·1 cites·4 claims
- 2451US2021162674A1Apparatus for supplying pellet and method for supplying pelletELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Application pending·0 cites
- 2550US9293795B2Apparatus and method for controlling cooling of battery of environment-friendly vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Mar 22, 2016·0 cites·10 claims
- 2650US2010142115A1Buried capacitor, method of manufacturing the same, and method of changing capacitance thereofKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 2744US9006037B2Methods of forming bump and semiconductor device with the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Apr 14, 2015·0 cites·14 claims
- 2843US2015228617A1Semiconductor device and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 2942US2013328200A1Direct bonded copper substrate and power semiconductor moduleAND TELECOMM RES INST ELECTRONICS·Filed 2013·Application pending·0 cites
- 3041US2019287870A1Filling composition for semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Application pending·0 cites
- 3141US2014367375A1Method of fabricating a solder particleKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 3241US2019211231A1Adhesive film for electric device and method of fabricating semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Application pending·0 cites
- 3340US9034750B2Method of fabricating a solder-on-pad structure and flip-chip bonding method using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted May 19, 2015·0 cites·13 claims
- 3440US2012161326A1Composition for filling through silicon via (tsv), tsv filling method and substrate including tsv plug formed of the compositionCHOI KWANG-SEONG·Filed 2011·Application pending·0 cites
- 3539US2014189621A1Apparatus and method for modeling controller of can bus simulatorKYUNGSHIN CO LTD·Filed 2013·Application pending·0 cites
- 3638US2011227228A1Filling composition, semiconductor device including the same, and method of fabricating the semiconductor deviceKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
- 3737US8524571B2Vacuum wafer level packaging method for micro electro mechanical system deviceMOON JONG TAE·Filed 2011·Granted Sep 3, 2013·0 cites·8 claims
- 3837US2011115036A1Device packages and methods of fabricating the sameKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
- 3937US2011090651A1Package structureKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
- 4035US2012089329A1Navigation system for electric vehicle and navigation service method thereofKIM SUNG YUN·Filed 2010·Application pending·0 cites
- 4134US2012005343A1Communication access control system of vehicleJI SANG WOO·Filed 2010·Application pending·0 cites
- 4234US2012120930A1Vehicle network system interconnecting with a home networkJI SANG WOO·Filed 2011·Application pending·0 cites
- 4334US2006125046A1Integrated inductor and method of fabricating the sameBAE HYUN CHEOL·Filed 2005·Application pending·0 cites
- 4434US2016094258A1Transceiver module and communication apparatus including the sameKOREA ELECTRONICS TELECOMM·Filed 2015·Application pending·0 cites
- 4534US2016358892A1Semiconductor package and method for manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Application pending·0 cites
- 4632US2015364445A1Stack module package and method for manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2015·Application pending·0 cites
- 4731US2012154072A1Fbar duplexer module and fabrication method thereofBAE HYUN-CHEOL·Filed 2011·Application pending·0 cites
- 4830US2014180541A1Steering device having tilting and telescopic functionYU TAE YOUNG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →