Inventor · disambiguated record
Yong Sung Eom
Also filed as: EOM YONG S · EOM YONG SUNG
30 granted patents·28 pending applications·97 citations·filing 2002–2025
95Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST25KOREA ELECTRONICS TELECOMM19EOM YONG SUNG4CHOI KWANG-SEONG1CHU MOO JUNG1
Top patents by PatentIndex Score
58 records- 0195US9490198B1Transmitting and receiving packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted Nov 8, 2016·14 cites·13 claims
- 0288US10636761B2Method of fabricating a semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Apr 28, 2020·6 cites·11 claims
- 0383US9853010B2Method of fabricating a semiconductor packageELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE·Filed 2015·Granted Dec 26, 2017·7 cites·15 claims
- 0481US8211745B2Method and structure for bonding flip chipEOM YONG SUNG·Filed 2010·Granted Jul 3, 2012·7 cites·20 claims
- 0581US6707161B2Optical module package of flip chip bondingKOREA ELECTRONICS TELECOMM·Filed 2002·Granted Mar 16, 2004·20 cites·3 claims
- 0678US7520682B2Transceiver module and optical bench for passive alignmentKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Apr 21, 2009·9 cites·21 claims
- 0777US7244923B2Surface emitting laser device including optical sensor and optical waveguide device employing the sameKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Jul 17, 2007·5 cites·10 claims
- 0876US8030200B2Method for fabricating a semiconductor packageKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 4, 2011·6 cites·14 claims
- 0973US2025154325A1Vanillic acid-based organic-inorganic compound, curable composition, and production method thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 1071US2023391956A1Silyl ether isohexide-based organic-inorganic compound, method for preparing the same, and curable composition containing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1169US11618109B2Wire for electric bondingELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Apr 4, 2023·0 cites·13 claims
- 1269US8044757B2Electronic device including LTCC inductorKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 25, 2011·4 cites·10 claims
- 1369US2014318615A1Conductive composition, silicon solar cell including the same, and manufacturing method thereofKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 1468US6825065B2Method for optical module packaging of flip chip bondingKOREA ELECTRONICS TELECOMM·Filed 2003·Granted Nov 30, 2004·9 cites·5 claims
- 1566US8547278B2Sensing device having multi beam antenna arrayJUN DONG SUK·Filed 2010·Granted Oct 1, 2013·2 cites·10 claims
- 1666US8420722B2Composition and methods of forming solder bump and flip chip using the sameEOM YONG SUNG·Filed 2009·Granted Apr 16, 2013·3 cites·10 claims
- 1764US9462736B2Composition and methods of forming solder bump and flip chip using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Oct 4, 2016·1 cites·8 claims
- 1863US2012222738A1Conductive composition, silicon solar cell including the same, and manufacturing method thereofOH SOO YOUNG·Filed 2012·Application pending·0 cites
- 1963US2022402070A1Laser control structure and laser bonding method using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Application pending·0 cites
- 2061US12457833B2Electronic device and its repair methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2161US2021358885A1Laser bonding method and a semiconductor package including a bonding part and a bonding targetELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 2260US12349505B2Method of manufacturing electric deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 2360US2025062276A1Method for dipping adhesive materialELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 2459US9980393B2Pattern-forming method for forming a conductive circuit patternELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted May 22, 2018·0 cites·15 claims
- 2559US9538666B2Bonding structure of electronic equipmentELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Jan 3, 2017·1 cites·15 claims
- 2658US2021252620A1Transfer and bonding method using laserELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 2758US2013146342A1Pattern-forming composition and pattern-forming method using the sameEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 2857US11107790B2Laser bonding methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Aug 31, 2021·0 cites·15 claims
- 2956US12206056B2Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materialsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 3056US2024021570A1Bonding apparatusELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3155US9155236B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Granted Oct 6, 2015·0 cites·4 claims
- 3255US2023326810A1Microwave heating device and method for manufacturing semiconductor packaging using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3354US7012939B2Wavelength stabilization module having light-receiving element array and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2003·Granted Mar 14, 2006·3 cites·10 claims
- 3453US2012288983A1Method for manufacturing dye sensitized solar cell moduleCHU MOO JUNG·Filed 2012·Application pending·0 cites
- 3552US11677060B2Method for transferring and bonding of devicesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jun 13, 2023·0 cites·12 claims
- 3652US11488841B2Method for manufacturing semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted Nov 1, 2022·0 cites·15 claims
- 3752US8802760B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Aug 12, 2014·0 cites·5 claims
- 3852US2014062786A1Sensing device having multi beam antenna arrayKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 3950US2025282908A1Flux agent and semiconductor package including cured product thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 4049US2022077099A1Composition for conductive adhesive, semiconductor package comprising cured product thereof, and method of manufacturing semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 4147US7985697B2Wafer level package and method of fabricating the sameKOREA ELECTRONICS TELECOMM·Filed 2008·Granted Jul 26, 2011·0 cites·5 claims
- 4244US9006037B2Methods of forming bump and semiconductor device with the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Apr 14, 2015·0 cites·14 claims
- 4343US2012240727A1Method of manufacturing solder powder having diameter of sub-micrometers or several micrometersEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 4443US2015228617A1Semiconductor device and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 4542US2005053380A1Optical transceiver for reducing crosstalkFiled 2004·Application pending·0 cites
- 4641US2019287870A1Filling composition for semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Application pending·0 cites
- 4741US2014367375A1Method of fabricating a solder particleKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 4841US2019211231A1Adhesive film for electric device and method of fabricating semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Application pending·0 cites
- 4940US9034750B2Method of fabricating a solder-on-pad structure and flip-chip bonding method using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted May 19, 2015·0 cites·13 claims
- 5040US2012161326A1Composition for filling through silicon via (tsv), tsv filling method and substrate including tsv plug formed of the compositionCHOI KWANG-SEONG·Filed 2011·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →