Method of manufacturing solder powder having diameter of sub-micrometers or several micrometers

Abstract

Disclosed is a method of manufacturing a solder powder having a diameter of sub-micrometers or several micrometers, the method including: mixing solder powder having a diameter of 10 to 1000 micrometers with a polymer resin to obtain a mixture; heating the mixture to a temperature higher than a melting point of the solder powder in the mixture; applying ultrasonic waves to the heated mixture so that the diameter of the solder powder becomes 0.1 to 10 micrometers; and cooling the mixture to the room temperature without exposing the solder powder of 0.1 to 10 micrometers to the air.

1 . A method of manufacturing a solder powder having a diameter of sub-micrometers or several micrometers, the method comprising:
 mixing solder powder having a diameter of 10 to 1000 micrometers with a polymer resin to obtain a mixture;   heating the mixture to a temperature higher than a melting point of the solder powder in the mixture;   applying ultrasonic waves to the heated mixture so that the diameter of the solder powder becomes 0.1 to 10 micrometers; and   cooling the mixture to the room temperature without exposing the solder powder of 0.1 to 10 micrometers to the air.   
     
     
         2 . The method of  claim 1 , wherein the polymer resin is an epoxy resin or oils. 
     
     
         3 . The method of  claim 1 , wherein the melting point of the solder powder is 80° C. to 250° C. 
     
     
         4 . The method of  claim 1 , further comprising removing the polymer resin and performing a drying operation. 
     
     
         5 . The method of  claim 1 , further comprising adding at least one compound selected from the group consisting of a reducing agent, a hardener, and a catalyst.