Assignee
JIANG TONGBI
US·3 granted patents·7 pending applications·132 citations·filing 2004–2010
Top patents by PatentIndex Score
10 records- 0197US8723307B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameJIANG TONGBI·Filed 2010·Granted May 13, 2014·37 cites·22 claims
- 0294US8092734B2Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagersJIANG TONGBI·Filed 2004·Granted Jan 10, 2012·95 cites·55 claims
- 0357US2008142983A1Device having contact pad with a conductive layer and a conductive passivation layerJIANG TONGBI·Filed 2008·Application pending·0 cites
- 0451US8461685B2Substrate comprising a plurality of integrated circuitry die, and a substrateJIANG TONGBI·Filed 2005·Granted Jun 11, 2013·0 cites·16 claims
- 0551US2006138619A1Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationJIANG TONGBI·Filed 2006·Application pending·0 cites
- 0650US2006284319A1Chip-on-board assembliesJIANG TONGBI·Filed 2006·Application pending·0 cites
- 0749US2005255612A1Method of attaching a leadframe to singulated semiconductor diceJIANG TONGBI·Filed 2005·Application pending·0 cites
- 0848US2007166882A1Methods for fabricating chip-scale packages having carrier bondsJIANG TONGBI·Filed 2007·Application pending·0 cites
- 0948US2006103032A1Die attach material for TBGA or flexible circuitryJIANG TONGBI·Filed 2005·Application pending·0 cites
- 1048US2006197233A1Die attach material for TBGA or flexible circuitryJIANG TONGBI·Filed 2006·Application pending·0 cites
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