Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Abstract

A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

1 . An electrical connector for an integrated circuit package comprising: 
 a composite lead frame of a plastic material having a portion thereof including a conductive polymer, the lead frame transparent to radiation.    
   
   
       2 . The electrical connector of  claim 1 , further comprising: 
 an adhesive located on a portion of the composite lead frame.    
   
   
       3 . The electrical connector of  claim 1 , wherein the conductive polymer is a polyaniline.  
   
   
       4 . The electrical connector of  claim 1 , wherein the composite lead frame is transparent.  
   
   
       5 . A circuit card comprising: 
 at least one electronic device;    a circuit card; and    at least one connector for attaching a portion of the at least one electronic device to a portion of the circuit card, the at least one electronic device comprising an integrated circuit die attached to a portion of a plastic lead frame, the plastic lead frame including an intrinsic conductive polymer.    
   
   
       6 . The circuit card of  claim 5 , wherein the plastic lead frame further comprises a plastic lead frame structure coated with a conductive polymer.  
   
   
       7 . The circuit card of  claim 6 , wherein the conductive polymer coating is selected from the group consisting of polyaniline.  
   
   
       8 . The circuit card of  claim 7 , wherein the polyaniline coating is of a thickness between about 25 μm and about 75 μm.  
   
   
       9 . The circuit card of  claim 5 , wherein the plastic lead frame is composite plastic formed of a conventional polymer intermixed with a conductive polymer.  
   
   
       10 . A computer system comprising at least one circuit card including an electronic device connected to a portion of a plastic connector including an intrinsic polymer material transparent to radiation.  
   
   
       11 . The computer system of  claim 10 , wherein the plastic lead frame further comprises a plastic lead frame structure coated with a conductive polymeric coating.  
   
   
       12 . The computer system of  claim 11 , wherein the conductive polymeric coating is selected from the group consisting of polyaniline.  
   
   
       13 . The computer system of  claim 10 , wherein the plastic lead frame is composite plastic formed of a conventional polymer intermixed with a conductive polymer.  
   
   
       14 . An encapsulated assembly including portions of a lead frame extending therefrom and a semiconductor device comprising: 
 a lead frame of a plastic material that is conductive;    a semiconductor device having a plurality of bond pads; and    at least one connection between a portion of the lead frame and at least one bond pad of the integrated circuit die.    
   
   
       15 . The assembly of  claim 14 , further comprising: 
 an adhesive located on a portion of the lead frame.    
   
   
       16 . The assembly of  claim 14 , wherein the lead frame comprises a conductive polymer comprising polyaniline.  
   
   
       17 . The assembly of  claim 14 , wherein the lead frame comprises a transparent lead frame.  
   
   
       18 . The assembly of  claim 14 , wherein the at least one connection comprises a bond wire.  
   
   
       19 . The assembly of  claim 14 , wherein the at least one connection comprises a conductive epoxy.  
   
   
       20 . The assembly of  claim 14 , wherein the at least one connection comprises a Z-axis conductive material.