Assignee
KINSMAN LARRY D
US·2 granted patents·5 pending applications·12 citations·filing 2005–2012
Top patents by PatentIndex Score
7 records- 0183US8981511B2Multi-chip package for imaging systemsKINSMAN LARRY D·Filed 2012·Granted Mar 17, 2015·10 cites·18 claims
- 0270US8097895B2Electronic device package with an optical deviceKINSMAN LARRY D·Filed 2009·Granted Jan 17, 2012·2 cites·2 claims
- 0351US2011101514A1Vertical surface mount assembly and methodsKINSMAN LARRY D·Filed 2011·Application pending·0 cites
- 0451US2006292732A1Methods of flip-chip image sensor package fabricationKINSMAN LARRY D·Filed 2006·Application pending·0 cites
- 0550US2007000599A1Assembly method for semiconductor die and lead frameKINSMAN LARRY D·Filed 2006·Application pending·0 cites
- 0649US2006033190A1Vertically mountable and alignable semiconductor device packages and assemblies including the sameKINSMAN LARRY D·Filed 2005·Application pending·0 cites
- 0749US2006267184A1Varied-thickness heat sink for integrated circuit (IC) packageKINSMAN LARRY D·Filed 2006·Application pending·0 cites
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