Vertical surface mount assembly and methods

Abstract

A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferably, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradeable.

1 . A vertically mountable semiconductor device assembly, comprising:
 an alignment device including a recess defining an interconnection receptacle therein; and   a vertically mountable semiconductor device package including a semiconductor die wherein said alignment device comprises at least one contact and is adapted to receive said semiconductor die wherein said semiconductor die includes at least one bond pad and a plurality of edges; and   wherein said at least one bond pad is disposed proximate a single edge of said semiconductor die.   
     
     
         2 . The vertically mountable semiconductor device assembly of  claim 1 , wherein, upon interconnection of said alignment device and said vertically mountable semiconductor device package, said at least one contact resiliently abuts said at least one bond pad to establish an electrically conductive connection between said at least one contact and said at least one bond pad. 
     
     
         3 . The vertically mountable semiconductor device assembly of  claim 2 , wherein said interconnection receptacle is formed completely through said alignment device. 
     
     
         4 . The vertically mountable semiconductor device assembly of  claim 1 , wherein said vertically mounted semiconductor package further comprises a mounting element wherein the mounting element includes a curvilinear clip extending therefrom. 
     
     
         5 . The vertically mountable semiconductor device assembly of  claim 4 , wherein said alignment device includes a mounting element engager. 
     
     
         6 . The vertically mountable semiconductor device assembly of  claim 5 , wherein said mounting element and said mounting element engager are interconnectable with each other. 
     
     
         7 . The vertically mountable semiconductor device assembly of  claim 6 , wherein said mounting element and said mounting element engager are complementary to one another. 
     
     
         8 . The vertically mountable semiconductor device assembly of  claim 5 , wherein said mounting element engager includes an actuator;
 wherein said mounting element engager is adjustable from an engagement state to a non-engagement state; and   wherein said actuator controls said adjustment.   
     
     
         9 . The vertically mountable semiconductor device assembly of  claim 1 , wherein said alignment device includes a plurality of interconnection receptacles formed therein. 
     
     
         10 . The vertically mountable semiconductor device assembly of  claim 1 , wherein said vertically mountable semiconductor device package includes a retainer having a receptacle; and wherein at least a portion of said semiconductor die is disposed in said receptacle. 
     
     
         11 . The vertically mountable semiconductor device assembly of  claim 10 , wherein said vertically mountable semiconductor device package further includes an engagement mechanism disposed within said receptacle. 
     
     
         12 . The vertically mountable semiconductor device assembly of  claim 11 , wherein said engagement mechanism fixedly secures said semiconductor die within said receptacle. 
     
     
         13 . A computer including a vertically mountable semiconductor device package, the vertically mountable semiconductor device package comprising: an alignment device mountable to a carrier substrate, said alignment device including a body defining an interconnection receptacle; and a vertically mountable semiconductor device package including a semiconductor die, said interconnection receptacle being adapted to receive said semiconductor die wherein said semiconductor die includes at least one bond pad and a plurality of edges; and
 wherein said at least one bond pad is disposed proximate a single edge of said semiconductor die.