Vertically mountable and alignable semiconductor device packages and assemblies including the same

Abstract

A semiconductor device package includes a die, a package encapsulating at least a portion of the die, and a plurality of leads. Each lead of the plurality includes an external portion. The external portion of each lead is substantially planar and extends outward from a bottom edge of the package. The external portion of each lead may be oriented in a plane that is substantially parallel to a plane within which the die is located. A semiconductor device including these features may be part of an assembly that also includes an alignment device for orienting the semiconductor device package in nonparallel relation to a substrate.

1 . A packaged semiconductor device, comprising: 
 a semiconductor die;    a package encapsulating at least a portion of the semiconductor die; and    a plurality of leads, each lead of the plurality of leads including an external portion that consists essentially of a substantially planar element extending outward from a bottom edge of the package, at least a portion of each lead in communication with a bond pad of the semiconductor die.    
   
   
       2 . The packaged semiconductor device of  claim 1 , wherein each lead of the plurality of leads extends less than about one millimeter past the bottom edge.  
   
   
       3 . The packaged semiconductor device of  claim 1 , wherein each lead of the plurality of leads extends less than about one-half millimeter past the bottom edge.  
   
   
       4 . The packaged semiconductor device of  claim 1 , wherein each lead of the plurality of leads extends about 10 mils or less past the bottom edge.  
   
   
       5 . The packaged semiconductor device of  claim 1 , wherein a length each lead of the plurality of leads protrudes from the bottom edge and a thickness of each lead of the plurality of leads imparts that lead with rigidity.  
   
   
       6 . The packaged semiconductor device of  claim 5 , wherein each lead is substantially nondeformable.  
   
   
       7 . The packaged semiconductor device of  claim 1 , wherein the external portion of each lead extends along a plane oriented substantially parallel to a plane in which the semiconductor die is located.  
   
   
       8 . A packaged semiconductor device, comprising: 
 a semiconductor die;    a package covering at least a portion of the semiconductor die;    a plurality of leads in communication with corresponding bond pads of the semiconductor die, each lead of the plurality including an external portion consisting essentially of a substantially planar element extending outwardly from a single, bottom edge of the package in a plane substantially parallel to a plane of the semiconductor die.    
   
   
       9 . The packaged semiconductor device of  claim 8 , wherein each lead of the plurality of leads extends less than about one millimeter past the bottom edge.  
   
   
       10 . The packaged semiconductor device of  claim 8 , wherein each lead of the plurality of leads extends less than about one-half millimeter past the bottom edge.  
   
   
       11 . The packaged semiconductor device of  claim 8 , wherein each lead of the plurality of leads extends about 10 mils or less past the bottom edge.  
   
   
       12 . The packaged semiconductor device of  claim 8 , wherein a length each lead of the plurality of leads protrudes from the bottom edge and a thickness of each lead of the plurality of leads imparts that lead with rigidity.  
   
   
       13 . The packaged semiconductor device of  claim 12 , wherein each lead is substantially nondeformable.  
   
   
       14 . A semiconductor device assembly, comprising: 
 at least one semiconductor device package including: 
 a semiconductor die;  
 a package covering at least a portion of the semiconductor die; and  
 a plurality of leads in communication with corresponding bond pads of the semiconductor die, each lead of the plurality including an external portion consisting essentially of a substantially planar element protruding from a single, bottom edge of the package; and  
   an alignment device including a receptacle configured to removably receive the at least one semiconductor device package in a nonparallel orientation relative to a substrate.    
   
   
       15 . The assembly of  claim 14 , wherein each lead of the plurality of leads extends less than about one millimeter past the bottom edge.  
   
   
       16 . The assembly of  claim 14 , wherein each lead of the plurality of leads extends less than about one-half millimeter past the bottom edge.  
   
   
       17 . The assembly of  claim 14 , wherein each lead of the plurality of leads extends about 10 mils or less past the bottom edge.  
   
   
       18 . The assembly of  claim 14 , wherein a length each lead of the plurality of leads protrudes from the bottom edge and a thickness of each lead of the plurality of leads imparts that lead with rigidity.  
   
   
       19 . The assembly of  claim 14 , wherein each lead of the plurality of leads is substantially nondeformable.  
   
   
       20 . The assembly of  claim 14 , wherein the at least one semiconductor device package may be removed from the receptacle and replaced by at least one of another semiconductor device package and an upgrade thereof.  
   
   
       21 . The assembly of  claim 14 , wherein the alignment device includes a plurality of receptacles.  
   
   
       22 . The assembly of  claim 21 , wherein at least one semiconductor device package disposed in the receptacle is removable separately from another semiconductor device package disposed in another receptacle of the alignment device.  
   
   
       23 . The assembly of  claim 14 , wherein the external portion of each lead of the at least one semiconductor device package extends along a plane oriented substantially parallel to a plane in which the semiconductor die of the at least one semiconductor device package is located.