Assignee
KIRBY KYLE K
US·10 granted patents·4 pending applications·21 citations·filing 2004–2012
Top patents by PatentIndex Score
14 records- 0193US8404587B2Semiconductor with through-substrate interconnectKIRBY KYLE K·Filed 2011·Granted Mar 26, 2013·11 cites·15 claims
- 0278US8629057B2Semiconductor substrates with unitary vias and via terminals, and associated systems and methodsKIRBY KYLE K·Filed 2011·Granted Jan 14, 2014·3 cites·20 claims
- 0367US8907457B2Microelectronic devices with through-substrate interconnects and associated methods of manufacturingKIRBY KYLE K·Filed 2010·Granted Dec 9, 2014·1 cites·8 claims
- 0466US8679933B2Semiconductor device fabrication methodsKIRBY KYLE K·Filed 2011·Granted Mar 25, 2014·1 cites·24 claims
- 0565US9214391B2Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methodsKIRBY KYLE K·Filed 2008·Granted Dec 15, 2015·2 cites·20 claims
- 0664US9799562B2Vias and conductive routing layers in semiconductor substratesKIRBY KYLE K·Filed 2009·Granted Oct 24, 2017·2 cites·22 claims
- 0763US8283785B2Interconnect regionsKIRBY KYLE K·Filed 2010·Granted Oct 9, 2012·1 cites·22 claims
- 0852US8703518B2Packaged microelectronic imagers and methods of packaging microelectronic imagersKIRBY KYLE K·Filed 2011·Granted Apr 22, 2014·0 cites·20 claims
- 0952US8410612B2Interconnect regionsKIRBY KYLE K·Filed 2012·Granted Apr 2, 2013·0 cites·21 claims
- 1051US8753981B2Microelectronic devices with through-silicon vias and associated methods of manufacturingKIRBY KYLE K·Filed 2011·Granted Jun 17, 2014·0 cites·6 claims
- 1150US2006255316A1Etch solution for selectively removing siliconKIRBY KYLE K·Filed 2006·Application pending·0 cites
- 1247US2006270196A1Methods of forming semiconductor devices and electrical interconnect structures in semiconductor devices and intermediate structures formed therebyKIRBY KYLE K·Filed 2006·Application pending·0 cites
- 1344US2006145353A1Semiconductor interconnect having dome shaped conductive spring contactsKIRBY KYLE K·Filed 2006·Application pending·0 cites
- 1443US2006043534A1Microfeature dies with porous regions, and associated methods and systemsKIRBY KYLE K·Filed 2004·Application pending·0 cites
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