Assignee
LEI WEI-SHENG
US·33 granted patents·10 pending applications·372 citations·filing 2011–2015
Top patents by PatentIndex Score
43 records- 0198US9076860B1Residue removal from singulated die sidewallLEI WEI-SHENG·Filed 2014·Granted Jul 7, 2015·49 cites·22 claims
- 0298US8975163B1Laser-dominated laser scribing and plasma etch hybrid wafer dicingLEI WEI-SHENG·Filed 2014·Granted Mar 10, 2015·43 cites·21 claims
- 0397US8642448B2Wafer dicing using femtosecond-based laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 4, 2014·23 cites·13 claims
- 0496US9224650B2Wafer dicing from wafer backside and front sideLEI WEI-SHENG·Filed 2013·Granted Dec 29, 2015·23 cites·16 claims
- 0596US9018079B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 28, 2015·26 cites·13 claims
- 0696US8912075B1Wafer edge warp supression for thin wafer supported by tape frameLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·25 cites·20 claims
- 0796US8507363B2Laser and plasma etch wafer dicing using water-soluble die attach filmLEI WEI-SHENG·Filed 2011·Granted Aug 13, 2013·24 cites·15 claims
- 0895US9355907B1Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Granted May 31, 2016·14 cites·17 claims
- 0993US9601375B2UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Mar 21, 2017·9 cites·17 claims
- 1093US9159624B1Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Oct 13, 2015·9 cites·16 claims
- 1193US9093518B1Singulation of wafers having wafer-level underfillLEI WEI-SHENG·Filed 2014·Granted Jul 28, 2015·16 cites·26 claims
- 1293US8912078B1Dicing wafers having solder bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·13 cites·20 claims
- 1393US8703581B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Apr 22, 2014·13 cites·14 claims
- 1492US9012305B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 21, 2015·12 cites·15 claims
- 1589US8932939B1Water soluble mask formation by dry film laminationLEI WEI-SHENG·Filed 2014·Granted Jan 13, 2015·7 cites·20 claims
- 1687US9349648B2Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2014·Granted May 24, 2016·7 cites·13 claims
- 1787US9041198B2Maskless hybrid laser scribing and plasma etching wafer dicing processLEI WEI-SHENG·Filed 2013·Granted May 26, 2015·6 cites·4 claims
- 1886US8557683B2Multi-step and asymmetrically shaped laser beam scribingLEI WEI-SHENG·Filed 2011·Granted Oct 15, 2013·6 cites·13 claims
- 1985US9330977B1Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Granted May 3, 2016·4 cites·7 claims
- 2085US9112050B1Dicing tape thermal management by wafer frame support ring cooling during plasma dicingLEI WEI-SHENG·Filed 2014·Granted Aug 18, 2015·6 cites·17 claims
- 2184US8951819B2Wafer dicing using hybrid split-beam laser scribing process with plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 10, 2015·6 cites·12 claims
- 2283US9159621B1Dicing tape protection for wafer dicing using laser scribe processLEI WEI-SHENG·Filed 2014·Granted Oct 13, 2015·5 cites·23 claims
- 2383US8927393B1Water soluble mask formation by dry film vacuum lamination for laser and plasma dicingLEI WEI-SHENG·Filed 2014·Granted Jan 6, 2015·5 cites·6 claims
- 2482US8859397B2Method of coating water soluble mask for laser scribing and plasma etchLEI WEI-SHENG·Filed 2013·Granted Oct 14, 2014·4 cites·20 claims
- 2579US9263308B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2014·Granted Feb 16, 2016·3 cites·14 claims
- 2679US8940619B2Method of diced wafer transportationLEI WEI-SHENG·Filed 2013·Granted Jan 27, 2015·3 cites·15 claims
- 2776US9460966B2Method and apparatus for dicing wafers having thick passivation polymer layerLEI WEI-SHENG·Filed 2013·Granted Oct 4, 2016·3 cites·15 claims
- 2875US9129904B2Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etchLEI WEI-SHENG·Filed 2011·Granted Sep 8, 2015·3 cites·11 claims
- 2969US9275902B2Dicing processes for thin wafers with bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Mar 1, 2016·2 cites·25 claims
- 3067US9209084B2Maskless hybrid laser scribing and plasma etching wafer dicing processLEI WEI-SHENG·Filed 2014·Granted Dec 8, 2015·1 cites·6 claims
- 3165US9443765B2Water soluble mask formation by dry film vacuum lamination for laser and plasma dicingLEI WEI-SHENG·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 3265US9299611B2Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistanceLEI WEI-SHENG·Filed 2014·Granted Mar 29, 2016·1 cites·26 claims
- 3355US2015102467A1Method of diced wafer transportationLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 3454US2014363952A1Laser, plasma etch, and backside grind process for wafer dicingLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 3554US2015028446A1Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approachLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 3644US2015011073A1Laser scribing and plasma etch for high die break strength and smooth sidewallLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 3744US2015079760A1Alternating masking and laser scribing approach for wafer dicing using laser scribing and plasma etchLEI WEI-SHENG·Filed 2013·Application pending·0 cites
- 3844US2014273401A1Substrate laser dicing mask including laser energy absorbing water-soluble filmLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 3942US9126285B2Laser and plasma etch wafer dicing using physically-removable maskLEI WEI-SHENG·Filed 2011·Granted Sep 8, 2015·0 cites·15 claims
- 4041US2015037915A1Method and system for laser focus plane determination in a laser scribing processLEI WEI-SHENG·Filed 2013·Application pending·0 cites
- 4139US2012322235A1Wafer dicing using hybrid galvanic laser scribing process with plasma etchLEI WEI-SHENG·Filed 2011·Application pending·0 cites
- 4235US2015332970A1Carrier with thermally resistant film frame for supporting wafer during singulationLEI WEI-SHENG·Filed 2015·Application pending·0 cites
- 4334US2016197015A1Hybrid wafer dicing approach using a polygon scanning-based laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →