Method of diced wafer transportation

Abstract

Methods of dicing semiconductor wafers, and transporting singulated die, are described. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. The method also involves forming a water soluble material layer over and between the plurality of singulated dies, above the dicing tape.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a plurality of singulated dies disposed above a dicing tape;   a water soluble material layer disposed over and between the plurality of singulated die, above the dicing tape.   
     
     
         2 . The apparatus of  claim 1 , wherein the water soluble material layer comprises forming a material selected from the group consisting of polyvinyl alcohol, polyacrylic acid, dextran, polymethacrylic acid, polyethylene imine, and polyethylene oxide. 
     
     
         3 . The apparatus of  claim 1 , wherein the water soluble material layer has an etch rate in an aqueous solution approximately in the range of 1-15 microns per minute. 
     
     
         4 . The apparatus of  claim 1 , further comprising:
 a water soluble mask disposed on each of the plurality of singulated dies, between each of the plurality of singulated dies and the water soluble material layer.   
     
     
         5 . The apparatus of  claim 1 , wherein the dicing tape is housed in a frame.