Inventor · disambiguated record
Wei-Sheng Lei
Also filed as: LEI WEI · LEI WEI-SHENG
107 granted patents·35 pending applications·826 citations·filing 2009–2025
99Inventor score
Files withAPPLIED MATERIALS INC77LEI WEI-SHENG43PARK JUNGRAE5HOLDEN JAMES M3CHOWDHURY MOHAMMAD KAMRUZZAMAN2
Top patents by PatentIndex Score
142 records- 0198US11676832B2Laser ablation system for package fabricationAPPLIED MATERIALS INC·Filed 2020·Granted Jun 13, 2023·7 cites·18 claims
- 0298US9076860B1Residue removal from singulated die sidewallLEI WEI-SHENG·Filed 2014·Granted Jul 7, 2015·49 cites·22 claims
- 0398US8975163B1Laser-dominated laser scribing and plasma etch hybrid wafer dicingLEI WEI-SHENG·Filed 2014·Granted Mar 10, 2015·43 cites·21 claims
- 0497US9130057B1Hybrid dicing process using a blade and laserKUMAR PRABHAT·Filed 2014·Granted Sep 8, 2015·49 cites·20 claims
- 0597US8845854B2Laser, plasma etch, and backside grind process for wafer dicingAPPLIED MATERIALS INC·Filed 2013·Granted Sep 30, 2014·31 cites·9 claims
- 0697US8642448B2Wafer dicing using femtosecond-based laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 4, 2014·23 cites·13 claims
- 0796US9224650B2Wafer dicing from wafer backside and front sideLEI WEI-SHENG·Filed 2013·Granted Dec 29, 2015·23 cites·16 claims
- 0896US9142459B1Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum laminationKUMAR PRABHAT·Filed 2014·Granted Sep 22, 2015·27 cites·15 claims
- 0996US9018079B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 28, 2015·26 cites·13 claims
- 1096US8980727B1Substrate patterning using hybrid laser scribing and plasma etching processing schemesAPPLIED MATERIALS INC·Filed 2014·Granted Mar 17, 2015·28 cites·5 claims
- 1196US8912075B1Wafer edge warp supression for thin wafer supported by tape frameLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·25 cites·20 claims
- 1296US8507363B2Laser and plasma etch wafer dicing using water-soluble die attach filmLEI WEI-SHENG·Filed 2011·Granted Aug 13, 2013·24 cites·15 claims
- 1395US9355907B1Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Granted May 31, 2016·14 cites·17 claims
- 1495US9165832B1Method of die singulation using laser ablation and induction of internal defects with a laserPAPANU JAMES S·Filed 2014·Granted Oct 20, 2015·53 cites·20 claims
- 1595US8991329B1Wafer coatingAPPLIED MATERIALS INC·Filed 2014·Granted Mar 31, 2015·19 cites·20 claims
- 1694US11257790B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·3 cites·10 claims
- 1794US8969177B2Laser and plasma etch wafer dicing with a double sided UV-curable adhesive filmAPPLIED MATERIALS INC·Filed 2013·Granted Mar 3, 2015·17 cites·22 claims
- 1894US8883614B1Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approachAPPLIED MATERIALS INC·Filed 2013·Granted Nov 11, 2014·27 cites·18 claims
- 1994US8883615B1Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processesHOLDEN JAMES MATTHEW·Filed 2014·Granted Nov 11, 2014·33 cites·19 claims
- 2094US8853056B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Oct 7, 2014·9 cites·10 claims
- 2193US9601375B2UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Mar 21, 2017·9 cites·17 claims
- 2293US9159624B1Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Oct 13, 2015·9 cites·16 claims
- 2393US9093518B1Singulation of wafers having wafer-level underfillLEI WEI-SHENG·Filed 2014·Granted Jul 28, 2015·16 cites·26 claims
- 2493US8912078B1Dicing wafers having solder bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·13 cites·20 claims
- 2593US8703581B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Apr 22, 2014·13 cites·14 claims
- 2693US8557682B2Multi-layer mask for substrate dicing by laser and plasma etchHOLDEN JAMES M·Filed 2011·Granted Oct 15, 2013·13 cites·15 claims
- 2792US9012305B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 21, 2015·12 cites·15 claims
- 2892US8598016B2In-situ deposited mask layer for device singulation by laser scribing and plasma etchYALAMANCHILI MADHAVA RAO·Filed 2011·Granted Dec 3, 2013·20 cites·29 claims
- 2992US2025022755A1Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3091US11232951B1Method and apparatus for laser drilling blind viasAPPLIED MATERIALS INC·Filed 2020·Granted Jan 25, 2022·2 cites·22 claims
- 3191US8652940B2Wafer dicing used hybrid multi-step laser scribing process with plasma etchAPPLIED MATERIALS INC·Filed 2013·Granted Feb 18, 2014·9 cites·20 claims
- 3289US11621194B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2020·Granted Apr 4, 2023·1 cites·12 claims
- 3389US10566238B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2018·Granted Feb 18, 2020·1 cites·10 claims
- 3489US8932939B1Water soluble mask formation by dry film laminationLEI WEI-SHENG·Filed 2014·Granted Jan 13, 2015·7 cites·20 claims
- 3587US9349648B2Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2014·Granted May 24, 2016·7 cites·13 claims
- 3687US9245803B1Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2014·Granted Jan 26, 2016·7 cites·14 claims
- 3787US9130056B1Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicingHOLDEN JAMES M·Filed 2014·Granted Sep 8, 2015·7 cites·30 claims
- 3887US9041198B2Maskless hybrid laser scribing and plasma etching wafer dicing processLEI WEI-SHENG·Filed 2013·Granted May 26, 2015·6 cites·4 claims
- 3987US8993414B2Laser scribing and plasma etch for high die break strength and clean sidewallAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·6 cites·18 claims
- 4086US12131952B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2023·Granted Oct 29, 2024·0 cites·9 claims
- 4186US10363629B2Mitigation of particle contamination for wafer dicing processesAPPLIED MATERIALS INC·Filed 2017·Granted Jul 30, 2019·3 cites·21 claims
- 4286US9852997B2Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2016·Granted Dec 26, 2017·4 cites·12 claims
- 4386US9252057B2Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer applicationAPPLIED MATERIALS INC·Filed 2013·Granted Feb 2, 2016·7 cites·16 claims
- 4486US9177864B2Method of coating water soluble mask for laser scribing and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Nov 3, 2015·5 cites·10 claims
- 4586US8557683B2Multi-step and asymmetrically shaped laser beam scribingLEI WEI-SHENG·Filed 2011·Granted Oct 15, 2013·6 cites·13 claims
- 4685US9330977B1Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Granted May 3, 2016·4 cites·7 claims
- 4785US9112050B1Dicing tape thermal management by wafer frame support ring cooling during plasma dicingLEI WEI-SHENG·Filed 2014·Granted Aug 18, 2015·6 cites·17 claims
- 4885US8980726B2Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafersAPPLIED MATERIALS INC·Filed 2014·Granted Mar 17, 2015·6 cites·20 claims
- 4985US8946057B2Laser and plasma etch wafer dicing using UV-curable adhesive filmAPPLIED MATERIALS INC·Filed 2013·Granted Feb 3, 2015·6 cites·29 claims
- 5085US2024409449A1Laser dicing glass wafers using advanced laser sourcesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
Showing the top 50 of 142 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →