Inventor · disambiguated record
Saravjeet Singh
Also filed as: SINGH SARAVJEET
55 granted patents·22 pending applications·452 citations·filing 2001–2024
98Inventor score
Top patents by PatentIndex Score
77 records- 0197US8845854B2Laser, plasma etch, and backside grind process for wafer dicingAPPLIED MATERIALS INC·Filed 2013·Granted Sep 30, 2014·31 cites·9 claims
- 0297US8642448B2Wafer dicing using femtosecond-based laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 4, 2014·23 cites·13 claims
- 0397US6673199B1Shaping a plasma with a magnetic field to control etch rate uniformityAPPLIED MATERIALS INC·Filed 2001·Granted Jan 6, 2004·107 cites·39 claims
- 0496US8507363B2Laser and plasma etch wafer dicing using water-soluble die attach filmLEI WEI-SHENG·Filed 2011·Granted Aug 13, 2013·24 cites·15 claims
- 0596US7935240B2Electroplating apparatus and method based on an array of anodesAPPLIED MATERIALS INC·Filed 2006·Granted May 3, 2011·37 cites·11 claims
- 0695US11834744B2Ceramic showerheads with conductive electrodesAPPLIED MATERIALS INC·Filed 2023·Granted Dec 5, 2023·2 cites·20 claims
- 0794US9287093B2Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (ICP) reactorSINGH SARAVJEET·Filed 2012·Granted Mar 15, 2016·19 cites·16 claims
- 0894US8853056B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Oct 7, 2014·9 cites·10 claims
- 0993US8703581B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Apr 22, 2014·13 cites·14 claims
- 1093US8557682B2Multi-layer mask for substrate dicing by laser and plasma etchHOLDEN JAMES M·Filed 2011·Granted Oct 15, 2013·13 cites·15 claims
- 1192US8598016B2In-situ deposited mask layer for device singulation by laser scribing and plasma etchYALAMANCHILI MADHAVA RAO·Filed 2011·Granted Dec 3, 2013·20 cites·29 claims
- 1292US7727364B2Auxiliary electrode encased in cation exchange membrane tube for electroplating cellAPPLIED MATERIALS INC·Filed 2006·Granted Jun 1, 2010·17 cites·27 claims
- 1392US2025022755A1Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1491US10811232B2Multi-plate faceplate for a processing chamberAPPLIED MATERIALS INC·Filed 2017·Granted Oct 20, 2020·13 cites·15 claims
- 1591US8652940B2Wafer dicing used hybrid multi-step laser scribing process with plasma etchAPPLIED MATERIALS INC·Filed 2013·Granted Feb 18, 2014·9 cites·20 claims
- 1690US9978632B2Direct lift process apparatusAPPLIED MATERIALS INC·Filed 2015·Granted May 22, 2018·8 cites·17 claims
- 1790US8753474B2Method and apparatus for high efficiency gas dissociation in inductive couple plasma reactorNANGOY ROY C·Filed 2010·Granted Jun 17, 2014·11 cites·14 claims
- 1889US11621194B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2020·Granted Apr 4, 2023·1 cites·12 claims
- 1989US10903054B2Multi-zone gas distribution systems and methodsAPPLIED MATERIALS INC·Filed 2017·Granted Jan 26, 2021·5 cites·20 claims
- 2089US10566238B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2018·Granted Feb 18, 2020·1 cites·10 claims
- 2187US8993414B2Laser scribing and plasma etch for high die break strength and clean sidewallAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·6 cites·18 claims
- 2286US12131952B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2023·Granted Oct 29, 2024·0 cites·9 claims
- 2386US8557683B2Multi-step and asymmetrically shaped laser beam scribingLEI WEI-SHENG·Filed 2011·Granted Oct 15, 2013·6 cites·13 claims
- 2484US11581165B2Multi-zone gas distribution systems and methodsAPPLIED MATERIALS INC·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 2584US8951819B2Wafer dicing using hybrid split-beam laser scribing process with plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 10, 2015·6 cites·12 claims
- 2683US9305810B2Method and apparatus for fast gas exchange, fast gas switching, and programmable gas deliverySINGH SARAVJEET·Filed 2012·Granted Apr 5, 2016·6 cites·19 claims
- 2782US11915911B2Two piece electrode assembly with gap for plasma controlAPPLIED MATERIALS INC·Filed 2020·Granted Feb 27, 2024·1 cites·20 claims
- 2882US11637002B2Methods and systems to enhance process uniformityAPPLIED MATERIALS INC·Filed 2014·Granted Apr 25, 2023·4 cites·20 claims
- 2982US10892198B2Systems and methods for improved performance in semiconductor processingAPPLIED MATERIALS INC·Filed 2018·Granted Jan 12, 2021·4 cites·14 claims
- 3082US9054176B2Multi-step and asymmetrically shaped laser beam scribingAPPLIED MATERIALS INC·Filed 2013·Granted Jun 9, 2015·4 cites·6 claims
- 3180US10170277B2Apparatus and methods for dry etch with edge, side and back protectionSINGH SARAVJEET·Filed 2012·Granted Jan 1, 2019·4 cites·17 claims
- 3279US9263308B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2014·Granted Feb 16, 2016·3 cites·14 claims
- 3379US8940619B2Method of diced wafer transportationLEI WEI-SHENG·Filed 2013·Granted Jan 27, 2015·3 cites·15 claims
- 3477US10163713B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2016·Granted Dec 25, 2018·1 cites·13 claims
- 3577US9245802B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Jan 26, 2016·1 cites·15 claims
- 3677US7247222B2Electrochemical processing cellAPPLIED MATERIALS INC·Filed 2002·Granted Jul 24, 2007·18 cites·32 claims
- 3776US12148597B2Multi-zone gas distribution systems and methodsAPPLIED MATERIALS INC·Filed 2023·Granted Nov 19, 2024·0 cites·19 claims
- 3876US10910271B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2020·Granted Feb 2, 2021·0 cites·20 claims
- 3976US9488315B2Gas distribution apparatus for directional and proportional delivery of process gas to a process chamberAPPLIED MATERIALS INC·Filed 2014·Granted Nov 8, 2016·3 cites·18 claims
- 4075US10920319B2Ceramic showerheads with conductive electrodesAPPLIED MATERIALS INC·Filed 2019·Granted Feb 16, 2021·1 cites·14 claims
- 4175US9129904B2Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etchLEI WEI-SHENG·Filed 2011·Granted Sep 8, 2015·3 cites·11 claims
- 4274US10699879B2Two piece electrode assembly with gap for plasma controlAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·1 cites·20 claims
- 4374US8846498B2Wafer dicing using hybrid multi-step laser scribing process with plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Sep 30, 2014·2 cites·23 claims
- 4473US10714390B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2019·Granted Jul 14, 2020·0 cites·10 claims
- 4571US11591693B2Ceramic showerheads with conductive electrodesAPPLIED MATERIALS INC·Filed 2021·Granted Feb 28, 2023·0 cites·6 claims
- 4671US9236305B2Wafer dicing with etch chamber shield ring for film frame wafer applicationsAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·2 cites·14 claims
- 4771US8975162B2Wafer dicing from wafer backsideAPPLIED MATERIALS INC·Filed 2013·Granted Mar 10, 2015·2 cites·20 claims
- 4871US8912077B2Hybrid laser and plasma etch wafer dicing using substrate carrierSINGH SARAVJEET·Filed 2011·Granted Dec 16, 2014·2 cites·19 claims
- 4967US9224625B2Laser and plasma etch wafer dicing using water-soluble die attach filmAPPLIED MATERIALS INC·Filed 2013·Granted Dec 29, 2015·1 cites·15 claims
- 5067US9218992B2Hybrid laser and plasma etch wafer dicing using substrate carrierAPPLIED MATERIALS INC·Filed 2014·Granted Dec 22, 2015·1 cites·16 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →