Inventor · disambiguated record
Aparna Iyer
Also filed as: IYER APARNA
16 granted patents·6 pending applications·83 citations·filing 2011–2020
92Inventor score
Top patents by PatentIndex Score
22 records- 0193US8912078B1Dicing wafers having solder bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·13 cites·20 claims
- 0291US8999816B1Pre-patterned dry laminate mask for wafer dicing processesHOLDEN JAMES M·Filed 2014·Granted Apr 7, 2015·12 cites·19 claims
- 0391US8877119B2Method of synthesizing multi-phase oxide ceramics with small phase domain sizesJORDAN ERIC H·Filed 2011·Granted Nov 4, 2014·23 cites·2 claims
- 0486US9177864B2Method of coating water soluble mask for laser scribing and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Nov 3, 2015·5 cites·10 claims
- 0585US8980726B2Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafersAPPLIED MATERIALS INC·Filed 2014·Granted Mar 17, 2015·6 cites·20 claims
- 0684US8951819B2Wafer dicing using hybrid split-beam laser scribing process with plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 10, 2015·6 cites·12 claims
- 0782US8859397B2Method of coating water soluble mask for laser scribing and plasma etchLEI WEI-SHENG·Filed 2013·Granted Oct 14, 2014·4 cites·20 claims
- 0879US8940619B2Method of diced wafer transportationLEI WEI-SHENG·Filed 2013·Granted Jan 27, 2015·3 cites·15 claims
- 0971US9236305B2Wafer dicing with etch chamber shield ring for film frame wafer applicationsAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·2 cites·14 claims
- 1071US9105710B2Wafer dicing method for improving die packaging qualityAPPLIED MATERIALS INC·Filed 2013·Granted Aug 11, 2015·2 cites·20 claims
- 1171US8975162B2Wafer dicing from wafer backsideAPPLIED MATERIALS INC·Filed 2013·Granted Mar 10, 2015·2 cites·20 claims
- 1269US9275902B2Dicing processes for thin wafers with bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Mar 1, 2016·2 cites·25 claims
- 1367US10692765B2Transfer arm for film frame substrate handling during plasma singulation of wafersAPPLIED MATERIALS INC·Filed 2014·Granted Jun 23, 2020·1 cites·5 claims
- 1466US9299614B2Method and carrier for dicing a waferHOLDEN JAMES M·Filed 2014·Granted Mar 29, 2016·1 cites·9 claims
- 1565US9343366B2Dicing wafers having solder bumps on wafer backsideAPPLIED MATERIALS INC·Filed 2014·Granted May 17, 2016·1 cites·7 claims
- 1659US2020258780A1Transfer arm for film frame substrate handling during plasma singulation of wafersAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1755US2015102467A1Method of diced wafer transportationLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 1854US2015028446A1Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approachLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 1946US11195756B2Proximity contact cover ring for plasma dicingAPPLIED MATERIALS INC·Filed 2014·Granted Dec 7, 2021·0 cites·8 claims
- 2044US2015011073A1Laser scribing and plasma etch for high die break strength and smooth sidewallLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 2144US2014273401A1Substrate laser dicing mask including laser energy absorbing water-soluble filmLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 2243US2014057414A1Mask residue removal for substrate dicing by laser and plasma etchIYER APARNA·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →