Inventor · disambiguated record
Ajay Kumar
Also filed as: KUMAR AJAY · KUMAR AJAY HANDA
385 granted patents·114 pending applications·7,287 citations·filing 1995–2025
99Inventor score
Top patents by PatentIndex Score
499 records- 0199US8932802B2Atomic layer deposition lithographyAPPLIED MATERIALS INC·Filed 2013·Granted Jan 13, 2015·337 cites·16 claims
- 0299US7955516B2Etching of nano-imprint templates using an etch reactorAPPLIED MATERIALS INC·Filed 2007·Granted Jun 7, 2011·522 cites·17 claims
- 0398US9076860B1Residue removal from singulated die sidewallLEI WEI-SHENG·Filed 2014·Granted Jul 7, 2015·49 cites·22 claims
- 0498US8975163B1Laser-dominated laser scribing and plasma etch hybrid wafer dicingLEI WEI-SHENG·Filed 2014·Granted Mar 10, 2015·43 cites·21 claims
- 0598US6642127B2Method for dicing a semiconductor waferAPPLIED MATERIALS INC·Filed 2001·Granted Nov 4, 2003·274 cites·22 claims
- 0698US5845175ARigid interference gear mount for enhanced motion qualityXEROX CORP·Filed 1998·Granted Dec 1, 1998·112 cites·30 claims
- 0797US9130057B1Hybrid dicing process using a blade and laserKUMAR PRABHAT·Filed 2014·Granted Sep 8, 2015·49 cites·20 claims
- 0897US9106555B2Troubleshooting routing topology based on a reference topologyAGARWAL NAVNEET·Filed 2012·Granted Aug 11, 2015·108 cites·21 claims
- 0997US8845854B2Laser, plasma etch, and backside grind process for wafer dicingAPPLIED MATERIALS INC·Filed 2013·Granted Sep 30, 2014·31 cites·9 claims
- 1097US8784102B1Prophy cup for dental handpieceKUMAR AJAY·Filed 2011·Granted Jul 22, 2014·45 cites·6 claims
- 1197US8642448B2Wafer dicing using femtosecond-based laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 4, 2014·23 cites·13 claims
- 1297US7375038B2Method for plasma etching a chromium layer through a carbon hard mask suitable for photomask fabricationAPPLIED MATERIALS INC·Filed 2005·Granted May 20, 2008·42 cites·7 claims
- 1397US7370329B2System and method for state saves in a distributed data systemSUN MICROSYSTEMS INC·Filed 2002·Granted May 6, 2008·166 cites·48 claims
- 1496US9224650B2Wafer dicing from wafer backside and front sideLEI WEI-SHENG·Filed 2013·Granted Dec 29, 2015·23 cites·16 claims
- 1596US9142459B1Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum laminationKUMAR PRABHAT·Filed 2014·Granted Sep 22, 2015·27 cites·15 claims
- 1696US9018079B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 28, 2015·26 cites·13 claims
- 1796US8981973B2Successive-approximation-register (SAR) analog-to-digital converter (ADC) attenuation capacitor calibration method and apparatusMICROCHIP TECH INC·Filed 2014·Granted Mar 17, 2015·26 cites·23 claims
- 1896US8980727B1Substrate patterning using hybrid laser scribing and plasma etching processing schemesAPPLIED MATERIALS INC·Filed 2014·Granted Mar 17, 2015·28 cites·5 claims
- 1996US8912075B1Wafer edge warp supression for thin wafer supported by tape frameLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·25 cites·20 claims
- 2096US8507363B2Laser and plasma etch wafer dicing using water-soluble die attach filmLEI WEI-SHENG·Filed 2011·Granted Aug 13, 2013·24 cites·15 claims
- 2196US7763134B1Facer for insulation boards and other construction boardsBUILDING MATERIALS INVEST CORP·Filed 2006·Granted Jul 27, 2010·28 cites·19 claims
- 2295US9355907B1Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Granted May 31, 2016·14 cites·17 claims
- 2395US9165832B1Method of die singulation using laser ablation and induction of internal defects with a laserPAPANU JAMES S·Filed 2014·Granted Oct 20, 2015·53 cites·20 claims
- 2495US8991329B1Wafer coatingAPPLIED MATERIALS INC·Filed 2014·Granted Mar 31, 2015·19 cites·20 claims
- 2595US6759263B2Method of patterning a layer of magnetic materialFiled 2002·Granted Jul 6, 2004·109 cites·24 claims
- 2695US6394806B1Snap-in healing capNOBEL BIOCARE USA INC·Filed 2000·Granted May 28, 2002·125 cites·43 claims
- 2795US6058280AMolded quick change photoreceptor supportXEROX CORP·Filed 1997·Granted May 2, 2000·73 cites·30 claims
- 2894US10596551B2Reforming catalyst and a method of preparation thereofRELIANCE INDUSTRIES LTD·Filed 2015·Granted Mar 24, 2020·18 cites·7 claims
- 2994US9287093B2Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (ICP) reactorSINGH SARAVJEET·Filed 2012·Granted Mar 15, 2016·19 cites·16 claims
- 3094US8969177B2Laser and plasma etch wafer dicing with a double sided UV-curable adhesive filmAPPLIED MATERIALS INC·Filed 2013·Granted Mar 3, 2015·17 cites·22 claims
- 3194US8962224B2Methods for controlling defects for extreme ultraviolet lithography (EUVL) photomask substrateWU BANQIU·Filed 2013·Granted Feb 24, 2015·10 cites·20 claims
- 3294US8883614B1Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approachAPPLIED MATERIALS INC·Filed 2013·Granted Nov 11, 2014·27 cites·18 claims
- 3394US8883615B1Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processesHOLDEN JAMES MATTHEW·Filed 2014·Granted Nov 11, 2014·33 cites·19 claims
- 3494US8853056B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Oct 7, 2014·9 cites·10 claims
- 3594US8769519B2Personal and pooled virtual machine updateLEITMAN ROBERT K·Filed 2011·Granted Jul 1, 2014·107 cites·16 claims
- 3694US6561805B2Universal implant delivery systemNOBEL BIOCARE AB·Filed 2001·Granted May 13, 2003·114 cites·25 claims
- 3794US6382977B1Snap-in impression copingNOBEL BIOCARE USA INC·Filed 2000·Granted May 7, 2002·112 cites·69 claims
- 3893US10438176B2Multiple merchant payment processor platform apparatuses, methods and systemsVISA INT SERVICE ASS·Filed 2014·Granted Oct 8, 2019·26 cites·20 claims
- 3993US9601375B2UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Mar 21, 2017·9 cites·17 claims
- 4093US9159624B1Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Oct 13, 2015·9 cites·16 claims
- 4193US9093518B1Singulation of wafers having wafer-level underfillLEI WEI-SHENG·Filed 2014·Granted Jul 28, 2015·16 cites·26 claims
- 4293US8912078B1Dicing wafers having solder bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·13 cites·20 claims
- 4393US8703581B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Apr 22, 2014·13 cites·14 claims
- 4493US8277931B1Facer for insulation boards and other construction boardsKUMAR AJAY·Filed 2010·Granted Oct 2, 2012·15 cites·13 claims
- 4593US8268737B1Facer and construction materials made therewithKUMAR AJAY·Filed 2006·Granted Sep 18, 2012·17 cites·17 claims
- 4693US7771895B2Method of etching extreme ultraviolet light (EUV) photomasksAPPLIED MATERIALS INC·Filed 2006·Granted Aug 10, 2010·25 cites·26 claims
- 4793US7658969B2Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the sameAPPLIED MATERIALS INC·Filed 2006·Granted Feb 9, 2010·19 cites·9 claims
- 4892US9012305B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 21, 2015·12 cites·15 claims
- 4992US8598016B2In-situ deposited mask layer for device singulation by laser scribing and plasma etchYALAMANCHILI MADHAVA RAO·Filed 2011·Granted Dec 3, 2013·20 cites·29 claims
- 5092US7909961B2Method and apparatus for photomask plasma etchingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 22, 2011·21 cites·4 claims
Showing the top 50 of 499 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →