Assignee
LIN CHUN-HUNG
TW·6 granted patents·14 pending applications·27 citations·filing 2005–2020
Top patents by PatentIndex Score
20 records- 0190US9502360B2Stress compensation layer for 3D packagingLIN CHUN-HUNG·Filed 2012·Granted Nov 22, 2016·12 cites·20 claims
- 0282USD956590STPMS toolLIN CHUN HUNG·Filed 2020·Granted Jul 5, 2022·8 cites·1 claims
- 0372US8785402B2Compositions and assays for treatment and diagnosis of helicobacter pylori infection and conditionsLIN CHUN-HUNG·Filed 2010·Granted Jul 22, 2014·2 cites·5 claims
- 0465US8200431B2Navigation system capable of updating map data and method thereofLIN CHUN-HUNG·Filed 2009·Granted Jun 12, 2012·4 cites·16 claims
- 0559US9053621B2Image surveillance system and image surveillance methodLIN CHUN-HUNG·Filed 2013·Granted Jun 9, 2015·1 cites·10 claims
- 0649US8466291B21,5-dideoxy-1,5-imino-D-glucitol compoundsLIN CHUN-HUNG·Filed 2009·Granted Jun 18, 2013·0 cites·9 claims
- 0749US2013000872A1Fin Heat Sink with Improved Structure and Processing Method ThereofLIN CHUN-HUNG·Filed 2011·Application pending·0 cites
- 0847US2013048248A1Heat pipe manufacturing method and heat pipe thereofLIN CHUN-HUNG·Filed 2011·Application pending·0 cites
- 0947US2013119532A1Bumps for Chip Scale PackagingLIN CHUN-HUNG·Filed 2011·Application pending·0 cites
- 1046US2007063325A1Chip package structure and bumping processLIN CHUN-HUNG·Filed 2006·Application pending·0 cites
- 1146US2007063344A1Chip package structure and bumping processLIN CHUN-HUNG·Filed 2005·Application pending·0 cites
- 1245US2008048410A1Bicycle tube connectorLIN CHUN-HUNG·Filed 2006·Application pending·0 cites
- 1344US2007228689A1Bicycle frame tube structure for enhancing the rigidity of the bicycle frameLIN CHUN-HUNG·Filed 2006·Application pending·0 cites
- 1442US2012318480A1Heat sink having juxtaposed heat pipes and method for manufacturing the sameLIN CHUN-HUNG·Filed 2011·Application pending·0 cites
- 1541US2007080435A1Semiconductor packaging process and carrier for semiconductor packageLIN CHUN-HUNG·Filed 2005·Application pending·0 cites
- 1641US2007126097A1Chip package structureLIN CHUN-HUNG·Filed 2006·Application pending·0 cites
- 1740US2013048247A1Heat pipe manufacturing method and heat pipe thereofLIN CHUN-HUNG·Filed 2011·Application pending·0 cites
- 1839US2013048249A1Heat pipe manufacturing method and heat pipe thereofLIN CHUN-HUNG·Filed 2011·Application pending·0 cites
- 1936US2007229139A1Level shifter circuit with a wide operating voltage rangeLIN CHUN-HUNG·Filed 2006·Application pending·0 cites
- 2030US2013118717A1Heat-dissipating device and method for fabricating the sameLIN CHUN-HUNG·Filed 2011·Application pending·0 cites
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