Heat-dissipating device and method for fabricating the same

Abstract

A heat-dissipating device includes a plurality of fin plates arranged adjacently to each other, a heat pipe and a cover board. Each fin plate has at least two fixing tabs protruded from a top edge thereof, and a supporting portion formed between the fixing tabs. An accommodating space is defined between the supporting portion and the fixing tabs. The heat pipe has a portion disposed in the accommodating space. The cover board is formed with a plurality of slits corresponding to the fixing tabs. The fixing tabs pass through the slits and fixed to the cover board.

What is claimed is: 
     
         1 . A heat-dissipating device, comprising:
 a plurality of fin plates, arranged in contiguous manner, each of the fin plates including:
 at least one fixing tab protruded from a top edge thereof; and 
 a supporting portion arranged adjacent to the at least one fixing tab; 
   wherein an accommodating space is defined between the supporting portions and the fixing tabs;   a heat pipe having a part disposed in the accommodating space; and   a cover board formed with a plurality of slits corresponding to the fixing tabs, wherein the fixing tabs pass through the slits and is fixed with the cover board.   
     
     
         2 . The heat-dissipating device of  claim 1 , wherein the supporting portion of the fin plates are bent partially from a top edge thereof toward one side. 
     
     
         3 . The heat-dissipating device of  claim 1 , wherein each of the fin plates further includes a first connecting plate and a second connecting plate, wherein the first connecting plate is located at an outer side of the fixing tab and is bent from a top edge of the fin plate toward one side, wherein the second connecting plate is bent from a bottom edge of the fin plate toward one side. 
     
     
         4 . The heat-dissipating device of  claim 1 , wherein each of the fixing tabs has a top end bent toward one side and press against a top surface of the cover board. 
     
     
         5 . The heat-dissipating device of  claim 1 , wherein the cover board further includes an extending portion extended toward one side, and a heat-dissipating fan is fixed on the extending portion adjacent the fin plates. 
     
     
         6 . The heat-dissipating device of  claim 1 , further comprising at least one elastic leaf disposed on a bottom surface of the cover board and elastically against a top surface of the heat pipe. 
     
     
         7 . The heat-dissipating device of  claim 1 , further comprising at least one thermal-insulating pad disposed between the cover board and the heat pipe. 
     
     
         8 . The heat-dissipating device of  claim 1 , wherein the cover board is a metal board or a plastic board. 
     
     
         9 . A method for fabricating a heat-dissipating device, comprising steps as followed:
 providing a plurality of fin plates, and forming at least one fixing tab on a top edge of each fin plate;   forming a supporting portion between the fixing tabs, and defining an accommodating space between the supporting portion and the fixing tabs;   providing a heat pipe, and disposing one part of the heat pipe in the accommodating space;   providing a cover board, and forming a plurality of slits on the cover board corresponding to the fixing tabs; and   passing the fixing tabs through the slits and fixing to the cover board.   
     
     
         10 . The method for fabricating a heat-dissipating device of  claim 9 , wherein the step of fixing the cover board further comprises a step of bending a top end of the fixing tab to press against a top surface of the cover board. 
     
     
         11 . The method for fabricating a heat-dissipating device of  claim 10 , further comprising a step of providing a shaping tool to bend the top end of the fixing tab. 
     
     
         12 . The method for fabricating a heat-dissipating device of  claim 11 , wherein the shaping tool has a plurality of pressing weights protruded from a bottom surface thereof to press the fixing tab. 
     
     
         13 . The method for fabricating a heat-dissipating device of  claim 12 , wherein the pressing weights are shaped in sawtooth, and each of the pressing weights has an oblique surface. 
     
     
         14 . The method for fabricating a heat-dissipating device of  claim 11 , wherein the step of bending the top end of the fixing tab includes a step of moving the shaping tool along the top surface of the cover board. 
     
     
         15 . The method for fabricating a heat-dissipating device of  claim 11 , further comprising a step of moving the shaping tool downward to flat the top ends against the cover board. 
     
     
         16 . The method for fabricating a heat-dissipating device of  claim 11 , wherein the fin plates of odd numbers have one fixing tab at left side, and the fin plats of even numbers have one fixing tab at right side.