Assignee
ROEGER-GOEPFERT CORNELIA
DE·6 granted patents·6 pending applications·10 citations·filing 2009–2021
Top patents by PatentIndex Score
12 records- 0176US9869029B2Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Granted Jan 16, 2018·4 cites·22 claims
- 0275US9631292B2Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect featuresROEGER-GOEPFERT CORNELIA·Filed 2012·Granted Apr 25, 2017·4 cites·20 claims
- 0365US9011666B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2009·Granted Apr 21, 2015·2 cites·20 claims
- 0456US9834677B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2011·Granted Dec 5, 2017·0 cites·28 claims
- 0556US2013133243A1Quaternized nitrogen compounds and use thereof as additives in fuels and lubricantsROEGER-GOEPFERT CORNELIA·Filed 2012·Application pending·0 cites
- 0651US2013264213A1Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2011·Application pending·0 cites
- 0744US2023407578A1Artificial turf system comprising hydrophobic sandROEGER GOEPFERT CORNELIA·Filed 2021·Application pending·0 cites
- 0843US2012018310A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Application pending·0 cites
- 0943US2012024711A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Application pending·0 cites
- 1039US9617647B2Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Granted Apr 11, 2017·0 cites·20 claims
- 1137US9598540B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2010·Granted Mar 21, 2017·0 cites·21 claims
- 1234US2012027948A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →