Assignee
SHENNAN CIRCUITS CO LTD
CN·30 granted patents·11 pending applications·1 citations·filing 2012–2024
Top patents by PatentIndex Score
41 records- 0181US12568586B2Inductor assembly and manufacturing method for inductor assemblySHENNAN CIRCUITS CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·15 claims
- 0269US2025087966A1Photoelectric conversion module, photoelectric conversion device, and photoelectric conversion methodSHENNAN CIRCUITS CO LTD·Filed 2024·Application pending·0 cites
- 0366US10652992B2Printed circuit board, method for manufacturing the same and electronic deviceSHENNAN CIRCUITS CO LTD·Filed 2019·Granted May 12, 2020·1 cites·27 claims
- 0465US2022279648A1Circuit board and method for manufacturing the sameSHENNAN CIRCUITS CO LTD·Filed 2022·Application pending·0 cites
- 0564US12495505B2Printed circuit board for phased array antenna transceiver assembly, transceiver assembly and radarSHENNAN CIRCUITS CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 0664US11632861B2Method for manufacturing embedded circuit board, embedded circuit board, and applicationSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·11 claims
- 0763US11906791B2Connection assembly, cable plug and cable assemblySHENNAN CIRCUITS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 0862US11342695B2Cable connection apparatus, connection assembly, and method for manufacturing connection assemblySHENNAN CIRCUITS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 0961US12016115B2Embedded circuit board, electronic device, and fabrication method thereforSHENNAN CIRCUITS CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 1060US12571975B2Photoelectric hybrid device based on glass waveguide and manufacturing method thereofSHENNAN CIRCUITS CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·10 claims
- 1160US12392973B2Optical fiber circuit board assembly and optical-electrical hybrid circuit boardSHENNAN CIRCUITS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·18 claims
- 1258US12366707B2Graded-index polymer waveguide and manufacturing method thereofSHENNAN CIRCUITS CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·11 claims
- 1355US11737212B2Electronic component package, electronic assembly, voltage regulation module, and voltage regulator memberSHENNAN CIRCUITS CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·18 claims
- 1454US12114436B2Composite circuit board and method of manufacturing the sameSHENNAN CIRCUITS CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1550US11862385B2Electronic device, connector, and electromagnetic device thereofSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Jan 2, 2024·0 cites·20 claims
- 1650US11272620B2Embedded circuit board, mobile terminal, and method for manufacturing embedded circuit boardSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
- 1750US2022246557A1Package chip and method of manufacturing the same, rewiring package chip and method of manufacturing the sameSHENNAN CIRCUITS CO LTD·Filed 2022·Application pending·0 cites
- 1849US11711893B2Electronic component, voltage regulation module and voltage stabilizerSHENNAN CIRCUITS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·16 claims
- 1948US12217903B2Integrated transformer and electronic deviceSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Feb 4, 2025·0 cites·20 claims
- 2048US11602054B2Circuit board and method for manufacturing the sameSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·18 claims
- 2148US11452211B2Embedded circuit board and method of manufacturing sameSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·12 claims
- 2248US2023005758A1Packaged chip and manufacturing method thereof, rewired packaged chip and manufacturing method thereofSHENNAN CIRCUITS CO LTD·Filed 2021·Application pending·0 cites
- 2348US2024114625A1Circuit board and back drilling processing methodSHENNAN CIRCUITS CO LTD·Filed 2023·Application pending·0 cites
- 2447US11856702B2Adapter board, method for manufacturing the same and circuit board assembly using the sameSHENNAN CIRCUITS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·13 claims
- 2546US11545291B2Transformer, electromagnetic device and manufacturing method of the transformerSHENNAN CIRCUITS CO LTD·Filed 2019·Granted Jan 3, 2023·0 cites·17 claims
- 2646US11450472B2Electromagnetic device and method for manufacturing the sameSHENNAN CIRCUITS CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 2745US12120810B2Circuit board and preparation method thereforSHENNAN CIRCUITS CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·13 claims
- 2845US11317503B2Circuit board and manufacturing method thereofSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·16 claims
- 2945US2022381983A1Flexible optical waveguide board and method for manufacturing the sameSHENNAN CIRCUITS CO LTD·Filed 2021·Application pending·0 cites
- 3044US12538429B2Resistor-embedded circuit board and method for processing the resistor-embedded circuit boardSHENNAN CIRCUITS CO LTD·Filed 2021·Granted Jan 27, 2026·0 cites·20 claims
- 3144US2022015236A1Embedded circuit board and method for manufacturing the sameSHENNAN CIRCUITS CO LTD·Filed 2020·Application pending·0 cites
- 3243US11937377B2Circuit board preparation methodSHENNAN CIRCUITS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 3343US11488763B2Integrated transformer and electronic deviceSHENNAN CIRCUITS CO LTD·Filed 2019·Granted Nov 1, 2022·0 cites·20 claims
- 3443US2019333682A1Transformer, method for manufacturing the same and electromagnetic deviceSHENNAN CIRCUITS CO LTD·Filed 2019·Application pending·0 cites
- 3541US11324125B2Diversified assembly printed circuit board and method for making the sameSHENNAN CIRCUITS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·16 claims
- 3641US2021096312A1Optical fiber circuit board, multilayer optical fiber circuit board, and photo-electric hybrid circuit boardSHENNAN CIRCUITS CO LTD·Filed 2020·Application pending·0 cites
- 3739US11997799B2Method for manufacturing printed circuit boardSHENNAN CIRCUITS CO LTD·Filed 2021·Granted May 28, 2024·0 cites·18 claims
- 3838US11641719B2Manufacturing method of printed circuit boardSHENNAN CIRCUITS CO LTD·Filed 2020·Granted May 2, 2023·0 cites·13 claims
- 3938US2015115427A1Package structure and packaging method thereofSHENNAN CIRCUITS CO LTD·Filed 2012·Application pending·0 cites
- 4037US11317511B2Circuit boardSHENNAN CIRCUITS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·16 claims
- 4129US2023051542A1Battery protection circuit board and soldering methodSHENNAN CIRCUITS CO LTD·Filed 2021·Application pending·0 cites
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