Assignee
TAIWAN SEMICONDUCTOR MFG
TW·8,293 granted patents·819 pending applications·186,549 citations·filing 1987–2021
Top patents by PatentIndex Score
9,112 records- 0199US9379078B23D die stacking structure with fine pitchesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·86 cites·20 claims
- 0299US9372206B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1.8k cites·20 claims
- 0399US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0499US9362292B1Two-port SRAM cell structure for vertical devicesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 7, 2016·41 cites·20 claims
- 0599US9304403B2System and method for lithography alignmentTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 5, 2016·64 cites·20 claims
- 0699US9275925B2System and method for an improved interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 1, 2016·64 cites·20 claims
- 0799US9263511B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·1k cites·20 claims
- 0899US9257439B2Structure and method for FinFET SRAMTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·56 cites·20 claims
- 0999US9257399B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·232 cites·19 claims
- 1099US9251888B1SRAM cells with vertical gate-all-round MOSFETsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·70 cites·20 claims
- 1199US9236877B2Micro-electro-mechanical systems (MEMS), systems, and operating methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·49 cites·20 claims
- 1299US9236300B2Contact plugs in SRAM cells and the method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 12, 2016·1.4k cites·20 claims
- 1399US9223220B2Photo resist baking in lithography processTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 29, 2015·169 cites·20 claims
- 1499US9218872B1Memory chip and layout design for manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 22, 2015·85 cites·20 claims
- 1599US9209247B2Self-aligned wrapped-around structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·782 cites·20 claims
- 1699US9184054B1Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·786 cites·20 claims
- 1799US9184269B2Silicon and silicon germanium nanowire formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 10, 2015·39 cites·20 claims
- 1899US9153478B2Spacer etching process for integrated circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·118 cites·20 claims
- 1999US9146469B2Middle layer composition for trilayer patterning stackTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 29, 2015·115 cites·7 claims
- 2099US9105490B2Contact structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 11, 2015·1.6k cites·19 claims
- 2199US9053279B2Pattern modification with a preferred position functionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 9, 2015·104 cites·20 claims
- 2299US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 2399US9040334B2MEMS integrated pressure sensor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·68 cites·20 claims
- 2499US8993380B2Structure and method for 3D IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·900 cites·22 claims
- 2599US8975129B1Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·60 cites·20 claims
- 2699US8963258B2FinFET with bottom SiGe layer in source/drainTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 24, 2015·342 cites·20 claims
- 2799US8908421B2Methods and apparatus for FinFET SRAM arrays in integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 9, 2014·90 cites·20 claims
- 2899US8877554B2Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 4, 2014·621 cites·20 claims
- 2999US8860229B1Hybrid bonding with through substrate via (TSV)TAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 14, 2014·72 cites·20 claims
- 3099US8853025B2FinFET/tri-gate channel doping for multiple threshold voltage tuningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·507 cites·20 claims
- 3199US8836141B2Conductor layout technique to reduce stress-induced void formationsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 16, 2014·105 cites·13 claims
- 3299US8828823B2FinFET device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 9, 2014·194 cites·20 claims
- 3399US8823065B2Contact structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 2, 2014·1.3k cites·16 claims
- 3499US8809139B2Fin-last FinFET and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 19, 2014·224 cites·20 claims
- 3599US8803306B1Fan-out package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·599 cites·20 claims
- 3699US8802504B13D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·408 cites·20 claims
- 3799US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
- 3899US8785299B2Package with a fan-out structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·583 cites·19 claims
- 3999US8772109B2Apparatus and method for forming semiconductor contactsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 8, 2014·1.3k cites·12 claims
- 4099US8703565B2Bottom-notched SiGe FinFET formation using condensationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 22, 2014·207 cites·19 claims
- 4199US8669174B2Multi-die stacking using bumps with different sizesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 11, 2014·139 cites·20 claims
- 4299US8652894B2Method for fabricating a FinFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 18, 2014·394 cites·20 claims
- 4399US8497177B1Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 30, 2013·252 cites·20 claims
- 4499US8377798B2Method and structure for wafer to wafer bonding in semiconductor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·222 cites·23 claims
- 4599US8377779B1Methods of manufacturing semiconductor devices and transistorsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 19, 2013·437 cites·20 claims
- 4699US8367498B2Fin-like field effect transistor (FinFET) device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 5, 2013·267 cites·19 claims
- 4799US8362575B2Controlling the shape of source/drain regions in FinFETsTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·242 cites·18 claims
- 4899US8361842B2Embedded wafer-level bonding approachesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·628 cites·14 claims
- 4999US8053299B2Method of fabrication of a FinFET elementTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 8, 2011·244 cites·15 claims
- 5099US8048723B2Germanium FinFETs having dielectric punch-through stoppersTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 1, 2011·265 cites·17 claims
Showing the top 50 of 9,112 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →