Assignee
TESSERA INTERCONNECT MATERIALS
US·6 granted patents·8 pending applications·61 citations·filing 2004–2009
Top patents by PatentIndex Score
14 records- 0186US7238603B2Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrateTESSERA INTERCONNECT MATERIALS·Filed 2005·Granted Jul 3, 2007·13 cites·8 claims
- 0281US7721422B2Methods of making microelectronic assembliesTESSERA INTERCONNECT MATERIALS·Filed 2007·Granted May 25, 2010·7 cites·20 claims
- 0381US7546681B2Manufacturing method for wiring circuit substrateTESSERA INTERCONNECT MATERIALS·Filed 2006·Granted Jun 16, 2009·6 cites·13 claims
- 0481US7342802B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2004·Granted Mar 11, 2008·20 cites·26 claims
- 0579US7096578B2Manufacturing method for wiring circuit substrateTESSERA INTERCONNECT MATERIALS·Filed 2004·Granted Aug 29, 2006·15 cites·14 claims
- 0653US2008296254A1Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2008·Application pending·0 cites
- 0752US7505281B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2007·Granted Mar 17, 2009·0 cites·21 claims
- 0851US2010044860A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerTESSERA INTERCONNECT MATERIALS·Filed 2009·Application pending·0 cites
- 0948US2010071944A1Chip capacitor embedded pwbTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 1041US2008264678A1Member for Interconnecting Wiring Films and Method for Producing the SameTESSERA INTERCONNECT MATERIALS·Filed 2005·Application pending·0 cites
- 1138US2008136041A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 1235US2008128288A1Method of manufacturing a multi-layer wiring board using a metal member having a rough surfaceTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 1334US2007221329A1Apparatus and method for distributing a liquid onto a surface of an itemTESSERA INTERCONNECT MATERIALS·Filed 2006·Application pending·0 cites
- 1433US2008169568A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →