Assignee
TOGAWA TETSUJI
JP·2 granted patents·3 pending applications·7 citations·filing 2005–2009
Top patents by PatentIndex Score
5 records- 0175US8292694B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodTOGAWA TETSUJI·Filed 2009·Granted Oct 23, 2012·4 cites·13 claims
- 0266US8870625B2Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing methodTOGAWA TETSUJI·Filed 2008·Granted Oct 28, 2014·3 cites·13 claims
- 0358US2010056028A1Substrate holding apparatus and polishing apparatusTOGAWA TETSUJI·Filed 2009·Application pending·0 cites
- 0454US2009011690A1Polishing apparatus and polishing methodTOGAWA TETSUJI·Filed 2008·Application pending·0 cites
- 0547US2006079092A1Polishing methodTOGAWA TETSUJI·Filed 2005·Application pending·0 cites
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