Polishing method

Abstract

The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface ( 10 ) with use of a top ring ( 23 ) for holding the semiconductor wafer (W). A pressure chamber ( 70 ) is defined in the top ring ( 23 ) by attaching an elastic membrane ( 60 ) to a lower surface of a vertically movable member ( 62 ). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber ( 70 ) so that the semiconductor wafer (W) is pressed against the polishing surface ( 10 ) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring ( 23 ) by ejecting the pressurized fluid from an opening ( 62 a ) defined centrally in the vertically movable member ( 62 ).

1 - 5 . (canceled)  
     
     
         6 . A polishing apparatus for polishing a workpiece, said polishing apparatus comprising: 
 a polishing surface; and    a top ring for holding a workpiece and pressing the workpiece against said polishing surface, said top ring including: 
 a vertically movable member,  
 an elastic membrane attached to a lower surface of said vertically movable member,  
 a pressure chamber defined in said top ring by said elastic membrane,  
 a fluid passage to supply a pressurized fluid to said pressure chamber so that the workpiece is pressed against said polishing surface by a fluid pressure of the fluid when the workpiece is polished, and  
 an opening defined centrally in the vertically movable member for ejecting a pressurized fluid therefrom to release the workpiece which has been polished.  
   
     
     
         7 . The polishing apparatus according to  claim 6 , wherein said top ring further comprising a hole provided in a surface, to be brought into close contact with the workpiece, of said elastic membrane which defines said pressure chamber for ejecting a pressurized fluid therefrom to release the workpiece which has been polished.  
     
     
         8 . The polishing apparatus according to  claim 7 , wherein the pressurized fluid is ejected from said opening defined centrally in said vertically movable member after the pressurized fluid is ejected from said hole of said elastic membrane.  
     
     
         9 . A polishing apparatus for polishing a workpiece, said polishing apparatus comprising: 
 a polishing surface; and    a top ring for holding a workpiece and pressing the workpiece against said polishing surface, said top ring including: 
 a vertically movable member,  
 an elastic membrane attached to a lower surface of said vertically movable member,  
 a pressure chamber defined in said top ring by said elastic membrane,  
 a fluid passage to supply a pressurized fluid to said pressure chamber so that the workpiece is pressed against said polishing surface by a fluid pressure of the fluid when the workpiece is polished, and  
 an attraction section provided on said vertically movable member for attracting the workpiece to said top ring by moving said vertically movable member downwardly so as to bring the workpiece into close contact with said attraction section when polishing of the workpiece is finished.  
   
     
     
         10 . A polishing apparatus for polishing a workpiece, said polishing apparatus comprising: 
 a polishing surface; and    a top ring for holding a workpiece and pressing the workpiece against said polishing surface, said top ring including: 
 a retainer ring which holds an outer circumferential edge of the workpiece,  
 a vertically movable member, said vertically movable member being positioned upwardly with respect to said retainer ring when the workpiece is guided to said top ring,  
 an attraction section provided on said vertically movable member for attracting the workpiece which has been guided to said top ring,  
 an elastic membrane attached to a lower surface of said vertically movable member,  
 a pressure chamber defined in said top ring by said elastic membrane, and  
 a fluid passage to supply a pressurized fluid to said pressure chamber so that the workpiece is pressed against said polished surface by a fluid pressure of the fluid when the workpiece is polished.