Assignee
VISWANATHAN LAKSHMINARAYAN
US·10 granted patents·2 pending applications·81 citations·filing 2012–2016
Top patents by PatentIndex Score
12 records- 0195US9362198B2Semiconductor devices with a thermally conductive layer and methods of their fabricationVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Jun 7, 2016·22 cites·20 claims
- 0292US9312231B2Method and apparatus for high temperature semiconductor device packages and structures using a low temperature processVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Apr 12, 2016·10 cites·5 claims
- 0391US9099567B2Packaged semiconductor devices and methods of their fabricationVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Aug 4, 2015·13 cites·25 claims
- 0490US9673162B2High power semiconductor package subsystemsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Jun 6, 2017·11 cites·10 claims
- 0589US8803302B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Aug 12, 2014·9 cites·19 claims
- 0686US9538659B2Solder wettable flanges and devices and systems incorporating solder wettable flangesVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Jan 3, 2017·6 cites·20 claims
- 0781US9589860B2Electronic devices with semiconductor die coupled to a thermally conductive substrateVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Mar 7, 2017·4 cites·34 claims
- 0881US9281283B2Semiconductor devices with impedance matching-circuitsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Mar 8, 2016·5 cites·16 claims
- 0968US9698116B2Thick-silver layer interface for a semiconductor die and corresponding thermal layerVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Jul 4, 2017·1 cites·8 claims
- 1056US9263375B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 1150US2015116961A1Method and structure for inhibiting dendrite formationVISWANATHAN LAKSHMINARAYAN·Filed 2013·Application pending·0 cites
- 1249US2016163623A1System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2016·Application pending·0 cites
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