System, method and apparatus for leadless surface mounted semiconductor package

Abstract

A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.

What is claimed is: 
     
         1 . A packaged semiconductor die (SD), comprising:
 a termination surface comprising a plurality of terminations configured as leadless interconnects to be surface mounted to a circuit board;   a first flange having a first surface of the first flange and a second surface of the first flange, the first surface of the first flange providing a first one of the plurality of terminations, wherein the second surface of the first flange is opposite to the first surface of the first flange;   a second flange having a first surface of the second flange and a second surface of the second flange, the first surface of the second flange providing a second one of the plurality of terminations, wherein the second surface of the second flange is opposite to the first surface of the second flange;   a die metallurgically attached to the second surface of the first flange with a Pb-free, die attach material having a melting point in excess of 240° C.; and   an electrical interconnect between the die and the second surface of the second flange opposite the termination surface, wherein the electrical interconnect, the first flange and the second flange are substantially housed within a body.   
     
     
         2 . The packaged SD according to  claim 1 , wherein the body is selected from a group consisting of a solid body that substantially encapsulates the flanges, the die, and the electrical interconnect to provide support thereto and a lid mounted to the packaged SD to house the electrical interconnect in an air cavity with the electrical interconnect being free of encapsulation material. 
     
     
         3 . The packaged SD according to  claim 1 , wherein all of the terminations of the packaged SD are on the termination surface, and the packaged SD has a power capacity of greater than about 30 W. 
     
     
         4 . The packaged SD according to  claim 1 , wherein all of the terminations of the packaged SD are on the termination surface. 
     
     
         5 . The packaged SD according to  claim 1 , wherein the packaged SD has a power capacity of greater than about 30 W. 
     
     
         6 . The packaged SD according to  claim 1 , wherein the body comprises a solid body that substantially encapsulates the flanges, the die, and the electrical interconnect to provide support thereto. 
     
     
         7 . The packaged SD according to  claim 1 , wherein the body comprises a lid mounted to the packaged SD to house the electrical interconnect in an air cavity with the electrical interconnect being free of encapsulation material. 
     
     
         8 . The packaged SD according to  claim 1 , wherein the die and the second flange have surfaces that are co-planar. 
     
     
         9 . The packaged SD according to  claim 8 , with a first surface of the die having been placed, at least temporarily, on an adhesive substrate with the first flange extending from a second surface of the die opposite the first surface. 
     
     
         10 . The packaged SD according to  claim 9 , wherein the die mounted to the second surface of the first flange form a first component, the second flange having been placed, at least temporarily, on the adhesive substrate adjacent to but spaced apart from the first component. 
     
     
         11 . The packaged SD according to  claim 1 , wherein at least portions of the die and the flanges are encapsulated to form an assembly, wherein an additional conductive layer of material is added to surfaces of the flanges opposite the die to form a termination surface with terminations configured to be surface mounted to a circuit board without leads external to the assembly.