Inventor · disambiguated record
Lakshmi N. Ramanathan
Also filed as: RAMANATHAN LAKSHMI · RAMANATHAN LAKSHMI N · RAMANATHAN LAKSHMI NARAYAN
10 granted patents·5 pending applications·84 citations·filing 2002–2025
87Inventor score
Files withFREESCALE SEMICONDUCTOR INC5RAMANATHAN LAKSHMI N3VERIZON PATENT & LICENSING INC3VISWANATHAN LAKSHMINARAYAN3CISCO TECH INC1
Top patents by PatentIndex Score
15 records- 0189US8803302B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Aug 12, 2014·9 cites·19 claims
- 0289US6951801B2Metal reduction in wafer scribe areaFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Oct 4, 2005·51 cites·24 claims
- 0375US7950144B2Method for controlling warpage in redistributed chip packaging panelsFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 31, 2011·7 cites·19 claims
- 0473US7812448B2Electronic device including a conductive stud over a bonding pad regionFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 12, 2010·5 cites·20 claims
- 0573US7723224B2Microelectronic assembly with back side metallization and method for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 25, 2010·7 cites·12 claims
- 0662US8236609B2Packaging an integrated circuit die with backside metallizationRAMANATHAN LAKSHMI N·Filed 2008·Granted Aug 7, 2012·3 cites·16 claims
- 0757US2025184294A1Systems and methods for analyzing chatbot communication sessions to reduce escalationVERIZON PATENT & LICENSING INC·Filed 2025·Application pending·0 cites
- 0856US9263375B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 0956US2024311841A1Systems and methods for multimodal supportVERIZON PATENT & LICENSING INC·Filed 2023·Application pending·0 cites
- 1056US2025379788A1Intelligent system to autonomously correlate bgp changes and impacts in a computer networkCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1151US12224968B2Systems and methods for analyzing chatbot communication sessions to reduce escalationVERIZON PATENT & LICENSING INC·Filed 2021·Granted Feb 11, 2025·0 cites·20 claims
- 1249US2016163623A1System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2016·Application pending·0 cites
- 1348US6803323B2Method of forming a component overlying a semiconductor substrateFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 12, 2004·2 cites·17 claims
- 1444US8530346B2Process of forming an electronic device including a conductive stud over a bonding pad regionRAMANATHAN LAKSHMI N·Filed 2010·Granted Sep 10, 2013·0 cites·20 claims
- 1535US2007090156A1Method for forming solder contacts on mounted substratesRAMANATHAN LAKSHMI N·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →