Assignee
WU ALBERT
US·12 granted patents·3 pending applications·69 citations·filing 2006–2012
Top patents by PatentIndex Score
15 records- 0190US8218383B1Memory repair system and methodWU ALBERT·Filed 2011·Granted Jul 10, 2012·9 cites·20 claims
- 0286US8999786B1Reducing source contact to gate spacing to decrease transistor pitchWU ALBERT·Filed 2008·Granted Apr 7, 2015·9 cites·20 claims
- 0381US7694440B1Insole cushioning device with repelling magnetic fieldWU ALBERT·Filed 2006·Granted Apr 13, 2010·24 cites·20 claims
- 0476US8462569B1Memory repair system and methodWU ALBERT·Filed 2012·Granted Jun 11, 2013·3 cites·16 claims
- 0576US8338934B2Embedded die with protective interposerWU ALBERT·Filed 2011·Granted Dec 25, 2012·4 cites·19 claims
- 0676US8330477B1Test engine for integrated circuit chip testingWU ALBERT·Filed 2009·Granted Dec 11, 2012·8 cites·13 claims
- 0774US9257410B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateWU ALBERT·Filed 2011·Granted Feb 9, 2016·2 cites·26 claims
- 0873US9070679B2Semiconductor package with a semiconductor die embedded within substratesWU ALBERT·Filed 2010·Granted Jun 30, 2015·3 cites·11 claims
- 0970US8241993B2Method for shallow trench isolationWU ALBERT·Filed 2008·Granted Aug 14, 2012·2 cites·23 claims
- 1069US8861214B1High resistivity substrate for integrated passive device (IPD) applicationsWU ALBERT·Filed 2007·Granted Oct 14, 2014·4 cites·4 claims
- 1169US8501619B1Methods for forming a plurality of contact holes in a microelectronic deviceWU ALBERT·Filed 2011·Granted Aug 6, 2013·1 cites·19 claims
- 1252US9034730B2Recessed semiconductor substrates and associated techniquesWU ALBERT·Filed 2011·Granted May 19, 2015·0 cites·23 claims
- 1352US2012319231A1Microelectronic Device Including Shallow Trench Isolation Structures Having Rounded Bottom SurfacesWU ALBERT·Filed 2012·Application pending·0 cites
- 1451US2011186960A1Techniques and configurations for recessed semiconductor substratesWU ALBERT·Filed 2011·Application pending·0 cites
- 1538US2010301467A1Wirebond structuresWU ALBERT·Filed 2010·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →