Assignee
X FAB SEMICONDUCTOR FOUNDRIES GMBH
DE·21 granted patents·5 pending applications·2 citations·filing 2016–2024
Top patents by PatentIndex Score
26 records- 0175US2024371669A1Carrier substrate for semiconductor structures suitable for a transfer by transfer print and manufacturing of the semiconductor structures on the carrier substrateX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2024·Application pending·0 cites
- 0271US11916104B2Trench insulation structure with enlarged electrically conductive side wallX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2022·Granted Feb 27, 2024·0 cites·9 claims
- 0366US10411049B2Optical sensor having two taps for photon-generated electrons of visible and IR lightX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2016·Granted Sep 10, 2019·1 cites·13 claims
- 0465US11829074B2Geometrically shaped components in an assembly for a transfer print and associated methodsX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Nov 28, 2023·0 cites·10 claims
- 0561US11355582B2Trench insulation structure with enlarged electrically conductive side wallX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Jun 7, 2022·0 cites·7 claims
- 0660US10199274B2Electrically conductive via(s) in a semiconductor substrate and associated production methodX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2017·Granted Feb 5, 2019·1 cites·29 claims
- 0760US2024355775A1Semiconductor wafer and (micro) transfer printing processX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2024·Application pending·0 cites
- 0858US11545569B2Method of fabricating a field-effect transistorX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Jan 3, 2023·0 cites·30 claims
- 0956US10845710B2Geometrically shaped components in an assembly for a transfer print and associated methodsX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2018·Granted Nov 24, 2020·0 cites·15 claims
- 1055US10672808B2Optical sensor having two taps for photon-generated electrons of visible and IR lightX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2019·Granted Jun 2, 2020·0 cites·11 claims
- 1152US11437266B2Method of manufacturing semiconductor devices to increase yield in micro-transfer printingX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Sep 6, 2022·0 cites·21 claims
- 1251US11276787B2Semiconductor device for light detectionX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Mar 15, 2022·0 cites·13 claims
- 1349US2020258863A1Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of SiliconX-FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Application pending·0 cites
- 1449US2020258862A1Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of SiliconX-FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Application pending·0 cites
- 1548US11398452B2Anodic bonding of a substrate of glass having contact vias to a substrate of siliconX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2019·Granted Jul 26, 2022·0 cites·37 claims
- 1647US11575061B2Single photon avalanche diode devicesX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 1747US10591537B2Sleek serial interface for a wrapper boundary register (device and method)X FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2018·Granted Mar 17, 2020·0 cites·27 claims
- 1846US10825728B2Electrically conductive via(s) in a semiconductor substrate and associated production methodX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2018·Granted Nov 3, 2020·0 cites·20 claims
- 1945US11795051B2Through silicon via and redistribution layerX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Oct 24, 2023·0 cites·16 claims
- 2045US10930497B2Semiconductor substrate and method for producing a semiconductor substrateX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2018·Granted Feb 23, 2021·0 cites·23 claims
- 2141US2020411343A1Real-time monitoring of a multi-zone vertical furnace with early detection of a failure of a heating zone elementX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2018·Application pending·0 cites
- 2240US11177410B2Electrically modulated IR sensitive photodiode and its integration in CMOSX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2019·Granted Nov 16, 2021·0 cites·17 claims
- 2338US11081411B2Semiconductor structureX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 2434US11469222B2ESD-protection device and MOS-transistor having at least one integrated ESD-protection deviceX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2020·Granted Oct 11, 2022·0 cites·18 claims
- 2528US11037812B2Method for a transfer print between substratesX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2017·Granted Jun 15, 2021·0 cites·9 claims
- 2625US10930359B2Programmable read-only memory having at least four memory cells, each having switching element and data storage element arranged so that each switching element is connected to at least two selection lines and the storage elements are shared by a data lineX FAB SEMICONDUCTOR FOUNDRIES GMBH·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
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