Inventor
TSENG HORNG-HUEI
TW414 patents
⚠️ This page may combine multiple inventors who share the name “TSENG HORNG-HUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VANGUARD INT SEMICONDUCT CORP
33 patentsUS6335257B1Jan 1, 2002
Method of making pillar-type structure on semiconductor substrate
VANGUARD INT SEMICONDUCT CORP159 citations99
US5716883AFeb 10, 1998
Method of making increased surface area, storage node electrode, with narrow spaces between polysilicon columns
VANGUARD INT SEMICONDUCT CORP164 citations99
US6596589B2Jul 22, 2003
Method of manufacturing a high coupling ratio stacked gate flash memory with an HSG-SI layer
VANGUARD INT SEMICONDUCT CORP99 citations98
US6429123B1Aug 6, 2002
Method of manufacturing buried metal lines having ultra fine features
VANGUARD INT SEMICONDUCT CORP92 citations98
US6358800B1Mar 19, 2002
Method of forming a MOSFET with a recessed-gate having a channel length beyond photolithography limit
VANGUARD INT SEMICONDUCT CORP148 citations98
US6093621AJul 25, 2000
Method of forming shallow trench isolation
VANGUARD INT SEMICONDUCT CORP127 citations98
US6090700AJul 18, 2000
Metallization method for forming interconnects in an integrated circuit
VANGUARD INT SEMICONDUCT CORP92 citations98
US5801082ASep 1, 1998
Method for making improved shallow trench isolation with dielectric studs for semiconductor integrated circuits
VANGUARD INT SEMICONDUCT CORP143 citations98
US6340614B1Jan 22, 2002
Method of forming a DRAM cell
VANGUARD INT SEMICONDUCT CORP64 citations96
US5907775AMay 25, 1999
Non-volatile memory device with high gate coupling ratio and manufacturing process therefor
VANGUARD INT SEMICONDUCT CORP83 citations96
US5766998AJun 16, 1998
Method for fabricating narrow channel field effect transistors having titanium shallow junctions
VANGUARD INT SEMICONDUCT CORP64 citations96
US5741741AApr 21, 1998
Method for making planar metal interconnections and metal plugs on semiconductor substrates
VANGUARD INT SEMICONDUCT CORP78 citations96
US5677221AOct 14, 1997
Method of manufacture DRAM capacitor with reduced layout area
VANGUARD INT SEMICONDUCT CORP88 citations96
US5595928AJan 21, 1997
High density dynamic random access memory cell structure having a polysilicon pillar capacitor
VANGUARD INT SEMICONDUCT CORP64 citations96
US5748478AMay 5, 1998
Output management of processing in a manufacturing plant
VANGUARD INT SEMICONDUCT CORP56 citations95
US6791142B2Sep 14, 2004
Stacked-gate flash memory and the method of making the same
VANGUARD INT SEMICONDUCT CORP43 citations93
US6642570B2Nov 4, 2003
Structure of flash memory with high coupling ratio
VANGUARD INT SEMICONDUCT CORP20 citations93
US6537880B1Mar 25, 2003
Method of fabricating a high density NAND stacked gate flash memory device having narrow pitch isolation and large capacitance between control and floating gates
VANGUARD INT SEMICONDUCT CORP36 citations93
US6498064B2Dec 24, 2002
Flash memory with conformal floating gate and the method of making the same
VANGUARD INT SEMICONDUCT CORP30 citations93
US6468862B1Oct 22, 2002
High capacitive-coupling ratio of stacked-gate flash memory having high mechanical strength floating gate
VANGUARD INT SEMICONDUCT CORP25 citations93
US6417048B1Jul 9, 2002
Method for fabricating flash memory with recessed floating gates
VANGUARD INT SEMICONDUCT CORP25 citations93
US6376342B1Apr 23, 2002
Method of forming a metal silicide layer on a source/drain region of a MOSFET device
VANGUARD INT SEMICONDUCT CORP39 citations93
US6316331B1Nov 13, 2001
Method of making dishing-free insulator in trench isolation
VANGUARD INT SEMICONDUCT CORP24 citations93
US6294434B1Sep 25, 2001
Method of forming a metal silicide layer on a polysilicon gate structure and on a source/drain region of a MOSFET device
VANGUARD INT SEMICONDUCT CORP42 citations93
US6294463B1Sep 25, 2001
Method for manufacturing diffusion barrier layer
VANGUARD INT SEMICONDUCT CORP19 citations93
US6284653B1Sep 4, 2001
Method of selectively forming a barrier layer from a directionally deposited metal layer
VANGUARD INT SEMICONDUCT CORP28 citations93
US6271147B1Aug 7, 2001
Methods of forming trench isolation regions using spin-on material
VANGUARD INT SEMICONDUCT CORP19 citations93
US5972793AOct 26, 1999
Photolithography alignment mark manufacturing process in tungsten CMP metallization
VANGUARD INT SEMICONDUCT CORP35 citations93
US5960417ASep 28, 1999
IC manufacturing costing control system and process
VANGUARD INT SEMICONDUCT CORP57 citations93
US5933741AAug 3, 1999
Method of making titanium silicide source/drains and tungsten silicide gate electrodes for field effect transistors
VANGUARD INT SEMICONDUCT CORP54 citations93
US5915177AJun 22, 1999
EPROM manufacturing process having a floating gate with a large surface area
VANGUARD INT SEMICONDUCT CORP28 citations93
US5899735AMay 4, 1999
Method for making low-resistance contacts between polysilicon and metal silicide on semiconductor integrated circuits
VANGUARD INT SEMICONDUCT CORP22 citations93
US5854105ADec 29, 1998
Method for making dynamic random access memory cells having double-crown stacked capacitors with center posts
VANGUARD INT SEMICONDUCT CORP43 citations93
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS9953874B2Apr 24, 2018
FinFETs and methods of forming FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9627379B1Apr 18, 2017
FinFET devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD35 citations94
US9620610B1Apr 11, 2017
FinFET gate structure and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US9601492B1Mar 21, 2017
FinFET devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD34 citations94
US9461044B1Oct 4, 2016
Fin field effect transistor, semiconductor device and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD44 citations94
US9716154B2Jul 25, 2017
Semiconductor structure having a gas-filled gap
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations93
US9576908B1Feb 21, 2017
Interconnection structure, fabricating method thereof, and semiconductor device using the same
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations93
US9570567B1Feb 14, 2017
Source and drain process for FinFET
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations93
TAIWAN SEMICONDUCTOR MFG
6 patentsUS7224427B2May 29, 2007
Megasonic immersion lithography exposure apparatus and method
TAIWAN SEMICONDUCTOR MFG95 citations98
US7224068B2May 29, 2007
Stable metal structure with tungsten plug
TAIWAN SEMICONDUCTOR MFG31 citations93
US7049702B2May 23, 2006
Damascene structure at semiconductor substrate level
TAIWAN SEMICONDUCTOR MFG41 citations93
US6977218B2Dec 20, 2005
Method for fabricating copper interconnects
TAIWAN SEMICONDUCTOR MFG22 citations93
US6958291B2Oct 25, 2005
Interconnect with composite barrier layers and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG19 citations93
US6841466B1Jan 11, 2005
Method of selectively making copper using plating technology
TAIWAN SEMICONDUCTOR MFG22 citations93
IND TECH RES INST
2 patents(unassigned)
1 patentShowing the top 50 of 414 patents by PatentIndex Score.