P

Inventor

TSENG HORNG-HUEI

TW414 patents
⚠️ This page may combine multiple inventors who share the name “TSENG HORNG-HUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VANGUARD INT SEMICONDUCT CORP

33 patents
US6335257B1Jan 1, 2002

Method of making pillar-type structure on semiconductor substrate

VANGUARD INT SEMICONDUCT CORP159 citations99
US5716883AFeb 10, 1998

Method of making increased surface area, storage node electrode, with narrow spaces between polysilicon columns

VANGUARD INT SEMICONDUCT CORP164 citations99
US6596589B2Jul 22, 2003

Method of manufacturing a high coupling ratio stacked gate flash memory with an HSG-SI layer

VANGUARD INT SEMICONDUCT CORP99 citations98
US6429123B1Aug 6, 2002

Method of manufacturing buried metal lines having ultra fine features

VANGUARD INT SEMICONDUCT CORP92 citations98
US6358800B1Mar 19, 2002

Method of forming a MOSFET with a recessed-gate having a channel length beyond photolithography limit

VANGUARD INT SEMICONDUCT CORP148 citations98
US6093621AJul 25, 2000

Method of forming shallow trench isolation

VANGUARD INT SEMICONDUCT CORP127 citations98
US6090700AJul 18, 2000

Metallization method for forming interconnects in an integrated circuit

VANGUARD INT SEMICONDUCT CORP92 citations98
US5801082ASep 1, 1998

Method for making improved shallow trench isolation with dielectric studs for semiconductor integrated circuits

VANGUARD INT SEMICONDUCT CORP143 citations98
US6340614B1Jan 22, 2002

Method of forming a DRAM cell

VANGUARD INT SEMICONDUCT CORP64 citations96
US5907775AMay 25, 1999

Non-volatile memory device with high gate coupling ratio and manufacturing process therefor

VANGUARD INT SEMICONDUCT CORP83 citations96
US5766998AJun 16, 1998

Method for fabricating narrow channel field effect transistors having titanium shallow junctions

VANGUARD INT SEMICONDUCT CORP64 citations96
US5741741AApr 21, 1998

Method for making planar metal interconnections and metal plugs on semiconductor substrates

VANGUARD INT SEMICONDUCT CORP78 citations96
US5677221AOct 14, 1997

Method of manufacture DRAM capacitor with reduced layout area

VANGUARD INT SEMICONDUCT CORP88 citations96
US5595928AJan 21, 1997

High density dynamic random access memory cell structure having a polysilicon pillar capacitor

VANGUARD INT SEMICONDUCT CORP64 citations96
US5748478AMay 5, 1998

Output management of processing in a manufacturing plant

VANGUARD INT SEMICONDUCT CORP56 citations95
US6791142B2Sep 14, 2004

Stacked-gate flash memory and the method of making the same

VANGUARD INT SEMICONDUCT CORP43 citations93
US6642570B2Nov 4, 2003

Structure of flash memory with high coupling ratio

VANGUARD INT SEMICONDUCT CORP20 citations93
US6537880B1Mar 25, 2003

Method of fabricating a high density NAND stacked gate flash memory device having narrow pitch isolation and large capacitance between control and floating gates

VANGUARD INT SEMICONDUCT CORP36 citations93
US6498064B2Dec 24, 2002

Flash memory with conformal floating gate and the method of making the same

VANGUARD INT SEMICONDUCT CORP30 citations93
US6468862B1Oct 22, 2002

High capacitive-coupling ratio of stacked-gate flash memory having high mechanical strength floating gate

VANGUARD INT SEMICONDUCT CORP25 citations93
US6417048B1Jul 9, 2002

Method for fabricating flash memory with recessed floating gates

VANGUARD INT SEMICONDUCT CORP25 citations93
US6376342B1Apr 23, 2002

Method of forming a metal silicide layer on a source/drain region of a MOSFET device

VANGUARD INT SEMICONDUCT CORP39 citations93
US6316331B1Nov 13, 2001

Method of making dishing-free insulator in trench isolation

VANGUARD INT SEMICONDUCT CORP24 citations93
US6294434B1Sep 25, 2001

Method of forming a metal silicide layer on a polysilicon gate structure and on a source/drain region of a MOSFET device

VANGUARD INT SEMICONDUCT CORP42 citations93
US6294463B1Sep 25, 2001

Method for manufacturing diffusion barrier layer

VANGUARD INT SEMICONDUCT CORP19 citations93
US6284653B1Sep 4, 2001

Method of selectively forming a barrier layer from a directionally deposited metal layer

VANGUARD INT SEMICONDUCT CORP28 citations93
US6271147B1Aug 7, 2001

Methods of forming trench isolation regions using spin-on material

VANGUARD INT SEMICONDUCT CORP19 citations93
US5972793AOct 26, 1999

Photolithography alignment mark manufacturing process in tungsten CMP metallization

VANGUARD INT SEMICONDUCT CORP35 citations93
US5960417ASep 28, 1999

IC manufacturing costing control system and process

VANGUARD INT SEMICONDUCT CORP57 citations93
US5933741AAug 3, 1999

Method of making titanium silicide source/drains and tungsten silicide gate electrodes for field effect transistors

VANGUARD INT SEMICONDUCT CORP54 citations93
US5915177AJun 22, 1999

EPROM manufacturing process having a floating gate with a large surface area

VANGUARD INT SEMICONDUCT CORP28 citations93
US5899735AMay 4, 1999

Method for making low-resistance contacts between polysilicon and metal silicide on semiconductor integrated circuits

VANGUARD INT SEMICONDUCT CORP22 citations93
US5854105ADec 29, 1998

Method for making dynamic random access memory cells having double-crown stacked capacitors with center posts

VANGUARD INT SEMICONDUCT CORP43 citations93

TAIWAN SEMICONDUCTOR MFG CO LTD

8 patents

TAIWAN SEMICONDUCTOR MFG

6 patents

IND TECH RES INST

2 patents

(unassigned)

1 patent

Showing the top 50 of 414 patents by PatentIndex Score.