Inventor · disambiguated record
Atsuo Uchiyama
Also filed as: UCHIYAMA ATSUO
8 granted patents·448 citations·filing 1991–2014
86Inventor score
Top patents by PatentIndex Score
8 records- 0196US5152857AMethod for preparing a substrate for semiconductor devicesSHINETSU HANDOTAI KK·Filed 1991·Granted Oct 6, 1992·345 cites·3 claims
- 0281US5395788AMethod of producing semiconductor substrateSHINETSU HANDOTAI KK·Filed 1993·Granted Mar 7, 1995·67 cites·6 claims
- 0358US5266824ASOI semiconductor substrateSHINETSU HANDOTAI KK·Filed 1992·Granted Nov 30, 1993·27 cites·6 claims
- 0457US9662805B2Method of resuming operation of wire sawSHINETSU HANDOTAI KK·Filed 2013·Granted May 30, 2017·1 cites·8 claims
- 0545US9163327B2Silicon wafer and a silicon epitaxial wafer having a polycrystal silicon layer formed on a major surface including boron concentration of the polycrystal silicon layer being 1×1015 atom/cm3 or lessMARUYAMA FUMIAKI·Filed 2012·Granted Oct 20, 2015·0 cites·6 claims
- 0643US8273146B1Wafer and epitaxial wafer, and manufacturing processes thereforMARUYAMA FUMIAKI·Filed 2000·Granted Sep 25, 2012·2 cites·11 claims
- 0738US10350788B2Method for slicing workpiece and workpiece holderSHINETSU HANDOTAI KK·Filed 2014·Granted Jul 16, 2019·0 cites·14 claims
- 0834US5213657AMethod for making uniform the thickness of a si single crystal thin filmSHINETSU HANDOTAI KK·Filed 1992·Granted May 25, 1993·6 cites·16 claims
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