Inventor
LO YI-JEN
TW26 patents
⚠️ This page may combine multiple inventors who share the name “LO YI-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NANYA TECHNOLOGY CORP
18 patentsUS11876077B2Jan 16, 2024
Semiconductor device and method of manufacturing the same
NANYA TECHNOLOGY CORP3 citations74
US11842979B2Dec 12, 2023
Semiconductor device and method of manufacturing the same
NANYA TECHNOLOGY CORP2 citations72
US10818508B2Oct 27, 2020
Semiconductor structure and method for preparing the same
NANYA TECHNOLOGY CORP4 citations72
US10811382B1Oct 20, 2020
Method of manufacturing semiconductor device
NANYA TECHNOLOGY CORP2 citations72
US12457733B2Oct 28, 2025
Semiconductor device having bonding structure and method of manufacturing the same
NANYA TECHNOLOGY CORP1 citations64
US12266622B2Apr 1, 2025
Method of manufacturing semiconductor structure having hybrid bonding pad
NANYA TECHNOLOGY CORP1 citations63
US12295137B2May 6, 2025
Method of manufacturing tsemiconductor device having bonding structure
NANYA TECHNOLOGY CORP0 citations62
US12278211B2Apr 15, 2025
Manufacturing method of semiconductor device
NANYA TECHNOLOGY CORP0 citations62
US11631656B2Apr 18, 2023
Method for manufacturing semiconductor structure
NANYA TECHNOLOGY CORP0 citations62
US11488840B2Nov 1, 2022
Wafer-to-wafer interconnection structure and method of manufacturing the same
NANYA TECHNOLOGY CORP0 citations62
US11482474B2Oct 25, 2022
Forming a self-aligned TSV with narrow opening in horizontal isolation layer interfacing substrate
NANYA TECHNOLOGY CORP0 citations62
US11342307B2May 24, 2022
Semiconductor structure and manufacturing method thereof
NANYA TECHNOLOGY CORP0 citations62
US12588540B2Mar 24, 2026
Semiconductor structure having dummy conductive member and manufacturing method thereof
NANYA TECHNOLOGY CORP0 citations51
US12588553B2Mar 24, 2026
Semiconductor structure having conductive pad with protrusion and manufacturing method thereof
NANYA TECHNOLOGY CORP0 citations51
US12400951B2Aug 26, 2025
Semiconductor device and method of manufacturing the same
NANYA TECHNOLOGY CORP0 citations51
US12293982B2May 6, 2025
Semiconductor structure having hybrid bonding pad
NANYA TECHNOLOGY CORP0 citations51
US11610878B1Mar 21, 2023
Semiconductor device with stacked chips and method for fabricating the same
NANYA TECHNOLOGY CORP0 citations51
US8003528B2Aug 23, 2011
Semiconductor structure and method for making the same
NANYA TECHNOLOGY CORP0 citations39
MICRON TECHNOLOGY INC
5 patentsUS10593637B2Mar 17, 2020
Multi-device packages and related microelectronic devices
MICRON TECHNOLOGY INC1 citations72
US9748106B2Aug 29, 2017
Method for fabricating semiconductor package
MICRON TECHNOLOGY INC2 citations72
US11211351B2Dec 28, 2021
Apparatuses including redistribution layers and related microelectronic devices
MICRON TECHNOLOGY INC0 citations62
US10679958B2Jun 9, 2020
Methods of manufacturing a multi-device package
MICRON TECHNOLOGY INC0 citations51
US10373922B2Aug 6, 2019
Methods of manufacturing a multi-device package
MICRON TECHNOLOGY INC0 citations51