Inventor · disambiguated record
Seiji Samukawa
Also filed as: SAMUKAWA SEIJI
40 granted patents·20 pending applications·2,445 citations·filing 1990–2023
98Inventor score
Top patents by PatentIndex Score
60 records- 0199US6861642B2Neutral particle beam processing apparatusEBARA CORP·Filed 2002·Granted Mar 1, 2005·421 cites·4 claims
- 0299US6849857B2Beam processing apparatusEBARA CORP·Filed 2002·Granted Feb 1, 2005·352 cites·10 claims
- 0398US5827435APlasma processing method and equipment used thereforNEC CORP·Filed 1995·Granted Oct 27, 1998·525 cites·16 claims
- 0495US8828886B2Low dielectric constant insulating film and method for forming the sameSAMUKAWA SEIJI·Filed 2012·Granted Sep 9, 2014·412 cites·17 claims
- 0593US6348158B1Plasma processing with energy suppliedNEC CORP·Filed 1999·Granted Feb 19, 2002·82 cites·15 claims
- 0693US5468341APlasma-etching method and apparatus thereforNEC CORP·Filed 1994·Granted Nov 21, 1995·81 cites·5 claims
- 0792US5401351ARadio frequency electron cyclotron resonance plasma etching apparatusNEC CORP·Filed 1994·Granted Mar 28, 1995·72 cites·7 claims
- 0890US6043608APlasma processing apparatusNEC CORP·Filed 1997·Granted Mar 28, 2000·73 cites·9 claims
- 0986US9620338B2System, method, and program for predicting processing shape by plasma processSAMUKAWA SEIJI·Filed 2011·Granted Apr 11, 2017·9 cites·7 claims
- 1085US11643724B2Method of forming structures using a neutral beamASM IP HOLDING BV·Filed 2020·Granted May 9, 2023·1 cites·17 claims
- 1185US7520956B2On-wafer monitoring systemTOHOKU TECHNO ARCH CO LTD·Filed 2003·Granted Apr 21, 2009·46 cites·11 claims
- 1284US12129548B2Method of forming structures using a neutral beamASM IP HOLDING BV·Filed 2023·Granted Oct 29, 2024·0 cites·18 claims
- 1384US5565738APlasma processing apparatus which uses a uniquely shaped antenna to reduce the overall size of the apparatus with respect to the plasma chamberNEC CORP·Filed 1995·Granted Oct 15, 1996·53 cites·13 claims
- 1482US7184134B2Real-time monitoring apparatus for plasma processSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Granted Feb 27, 2007·6 cites·18 claims
- 1579US7078862B2Beam source and beam processing apparatusUNIV TOHOKU·Filed 2004·Granted Jul 18, 2006·13 cites·26 claims
- 1679US6861643B2Neutral particle beam processing apparatusEBARA CORP·Filed 2002·Granted Mar 1, 2005·14 cites·17 claims
- 1776US6054063AMethod for plasma treatment and apparatus for plasma treatmentNEC CORP·Filed 1998·Granted Apr 25, 2000·28 cites·13 claims
- 1876US5900699APlasma generator with a shield interposing the antennaNEC CORP·Filed 1997·Granted May 4, 1999·49 cites·10 claims
- 1973US5818040ANeutral particle beam irradiation apparatusNEC CORP·Filed 1996·Granted Oct 6, 1998·43 cites·8 claims
- 2072US5366586APlasma formation using electron cyclotron resonance and method for processing substrate by using the sameNEC CORP·Filed 1993·Granted Nov 22, 1994·23 cites·18 claims
- 2171US7144520B2Etching method and apparatusJAPAN GOVERNMENT·Filed 2002·Granted Dec 5, 2006·13 cites·16 claims
- 2268US5936352APlasma processing apparatus for producing plasma at low electron temperaturesNEC CORP·Filed 1996·Granted Aug 10, 1999·20 cites·28 claims
- 2367US7000565B2Plasma surface treatment system and plasma surface treatment methodSONY CORP·Filed 2004·Granted Feb 21, 2006·11 cites·8 claims
- 2466US7473646B2Dry etching method and production method of magnetic memory deviceSONY CORP·Filed 2004·Granted Jan 6, 2009·8 cites·5 claims
- 2565US2017253972A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
- 2664US6177147B1Process and apparatus for treating a substrateNEC CORP·Filed 1999·Granted Jan 23, 2001·34 cites·17 claims
- 2763US8427168B2Plasma monitoring methodTATSUMI TOMOHIKO·Filed 2010·Granted Apr 23, 2013·2 cites·13 claims
- 2863US7808026B2Dry etching method and production method of magnetic memory deviceSONY CORP·Filed 2008·Granted Oct 5, 2010·1 cites·8 claims
- 2962US7034285B2Beam source and beam processing apparatusUNIV TOHOKU·Filed 2004·Granted Apr 25, 2006·13 cites·24 claims
- 3062US2009325328A1Plasma processing apparatus and plasma processing methodSEMICONDUCTOR TECH ACAD RES CT·Filed 2009·Application pending·0 cites
- 3161US7314574B2Etching method and apparatusEBARA CORP·Filed 2002·Granted Jan 1, 2008·7 cites·16 claims
- 3261US6858838B2Neutral particle beam processing apparatusEBARA CORP·Filed 2002·Granted Feb 22, 2005·4 cites·8 claims
- 3360US2025183045A1Method for fabrication of semiconductor structures and apparatus for fabrication of the sameNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2023·Application pending·0 cites
- 3459US2025079185A1Method of bonding semiconductor materials and structure formed by the sameNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2023·Application pending·0 cites
- 3558US9005461B2Plasma monitoring method and plasma monitoring systemTATSUMI TOMOHIKO·Filed 2008·Granted Apr 14, 2015·1 cites·10 claims
- 3658US6909086B2Neutral particle beam processing apparatusJAPAN GOVERNMENT·Filed 2002·Granted Jun 21, 2005·10 cites·16 claims
- 3758US2015197853A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
- 3856US2016017484A1Carbon film formation method, and carbon filmTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 3952US2005263247A1Plasma processing apparatus and plasma processing methodSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Application pending·0 cites
- 4050US7732783B2Ultraviolet light monitoring systemOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Jun 8, 2010·0 cites·11 claims
- 4150US6909087B2Method of processing a surface of a workpieceEBARA CORP·Filed 2002·Granted Jun 21, 2005·5 cites·17 claims
- 4250US5013401AMicrowave plasma etching method and apparatusNEC CORP·Filed 1990·Granted May 7, 1991·9 cites·8 claims
- 4345US9096937B2Method for etching film having transition metalTOKYO ELECTRON LTD·Filed 2014·Granted Aug 4, 2015·0 cites·10 claims
- 4444US11488833B2Method of manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Nov 1, 2022·0 cites·11 claims
- 4544US9412567B2Plasma monitoring method and plasma monitoring systemLAPIS SEMICONDUCTOR CO LTD·Filed 2015·Granted Aug 9, 2016·0 cites·7 claims
- 4644US7923268B2Method of measuring resistivity of sidewall of contact holeOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted Apr 12, 2011·0 cites·7 claims
- 4744US2008169064A1Surface-treating apparatusUSHIO ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4844US2017011886A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 4943US2006213444A1Deposition apparatus and deposition methodSEIJI SAMUKAWA·Filed 2006·Application pending·0 cites
- 5042US2015214015A1FILM FORMING APPARATUS, METHOD OF FORMING LOW-PERMITTIVITY FILM, SiCO FILM, AND DAMASCENE INTERCONNECT STRUCTURETOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
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