Inventor · disambiguated record
Howard H. Chen
Also filed as: CHEN HOWARD · CHEN HOWARD H · CHEN HOWARD HAO
43 granted patents·3 pending applications·1,059 citations·filing 1999–2018
98Inventor score
Top patents by PatentIndex Score
46 records- 0198US7369410B2Apparatuses for dissipating heat from semiconductor devicesIBM·Filed 2006·Granted May 6, 2008·101 cites·4 claims
- 0298US7170164B2Cooling system for a semiconductor device and method of fabricating sameIBM·Filed 2005·Granted Jan 30, 2007·91 cites·17 claims
- 0397US7489025B2Device and method for fabricating double-sided SOI wafer scale package with optical through via connectionsIBM·Filed 2006·Granted Feb 10, 2009·36 cites·22 claims
- 0496US7029951B2Cooling system for a semiconductor device and method of fabricating sameIBM·Filed 2003·Granted Apr 18, 2006·97 cites·35 claims
- 0596US6825534B2Semiconductor device on a combination bulk silicon and silicon-on-insulator (SOI) substrateIBM·Filed 2000·Granted Nov 30, 2004·113 cites·28 claims
- 0694US8598641B2Sea-of-fins structure on a semiconductor substrate and method of fabricationCHEN HOWARD H·Filed 2011·Granted Dec 3, 2013·16 cites·18 claims
- 0794US7098070B2Device and method for fabricating double-sided SOI wafer scale package with through via connectionsIBM·Filed 2004·Granted Aug 29, 2006·63 cites·29 claims
- 0893US8076190B2Sea-of-fins structure on a semiconductor substrate and method of fabricationCHEN HOWARD H·Filed 2009·Granted Dec 13, 2011·21 cites·4 claims
- 0993US6823293B2Hierarchical power supply noise monitoring device and system for very large scale integrated circuitsIBM·Filed 2002·Granted Nov 23, 2004·59 cites·24 claims
- 1092US7676775B2Method to determine the root causes of failure patterns by using spatial correlation of tester dataIBM·Filed 2007·Granted Mar 9, 2010·30 cites·13 claims
- 1191US7736949B2Device and method for fabricating double-sided SOI wafer scale package with optical through via connectionsIBM·Filed 2008·Granted Jun 15, 2010·16 cites·13 claims
- 1288US6781185B2Semiconductor high dielectric constant decoupling capacitor structures and process for fabricationIBM·Filed 2002·Granted Aug 24, 2004·46 cites·14 claims
- 1388US6728916B2Hierarchical built-in self-test for system-on-chip designIBM·Filed 2001·Granted Apr 27, 2004·51 cites·37 claims
- 1487US7214910B2On-chip power supply regulator and temperature control systemIBM·Filed 2004·Granted May 8, 2007·53 cites·28 claims
- 1587US6214653B1Method for fabricating complementary metal oxide semiconductor (CMOS) devices on a mixed bulk and silicon-on-insulator (SOI) substrateIBM·Filed 1999·Granted Apr 10, 2001·72 cites·23 claims
- 1686US10725755B2Systems, apparatuses, and methods for a hardware and software system to automatically decompose a program to multiple parallel threadsINTEL CORP·Filed 2017·Granted Jul 28, 2020·4 cites·17 claims
- 1785US7005319B1Global planarization of wafer scale package with precision die thickness controlIBM·Filed 2004·Granted Feb 28, 2006·40 cites·39 claims
- 1883US8416121B2Narrow-band wide-range frequency modulation continuous wave (FMCW) radar systemCHEN HOWARD H·Filed 2010·Granted Apr 9, 2013·10 cites·20 claims
- 1983US7947599B2Laser annealing for 3-D chip integrationIBM·Filed 2008·Granted May 24, 2011·7 cites·9 claims
- 2079US9672019B2Systems, apparatuses, and methods for a hardware and software system to automatically decompose a program to multiple parallel threadsSAGER DAVID J·Filed 2010·Granted Jun 6, 2017·6 cites·18 claims
- 2179US8129609B2Integrated thermoelectric cooling devices and methods for fabricating sameCHEN HOWARD HAO·Filed 2009·Granted Mar 6, 2012·9 cites·20 claims
- 2279US7499308B2Programmable heavy-ion sensing device for accelerated DRAM soft error detectionIBM·Filed 2007·Granted Mar 3, 2009·10 cites·6 claims
- 2379US7399686B2Method and apparatus for making coplanar dielectrically-isolated regions of different semiconductor materials on a substrateIBM·Filed 2005·Granted Jul 15, 2008·6 cites·20 claims
- 2479US6603690B1Low-power static column redundancy scheme for semiconductor memoriesIBM·Filed 2002·Granted Aug 5, 2003·27 cites·18 claims
- 2574US8086988B2Chip design and fabrication method optimized for profitBUCK NATHAN·Filed 2009·Granted Dec 27, 2011·7 cites·25 claims
- 2673US7867820B2Methods for forming co-planar wafer-scale chip packagesIBM·Filed 2008·Granted Jan 11, 2011·3 cites·8 claims
- 2772US8351166B2Leakage sensor and switch device for deep-trench capacitor arrayIBM·Filed 2009·Granted Jan 8, 2013·6 cites·16 claims
- 2872US7544883B2Integrated thermoelectric cooling devices and methods for fabricating sameIBM·Filed 2004·Granted Jun 9, 2009·15 cites·36 claims
- 2970US7405108B2Methods for forming co-planar wafer-scale chip packagesIBM·Filed 2004·Granted Jul 29, 2008·11 cites·41 claims
- 3067US9904546B2Instruction and logic for predication and implicit destinationINTEL CORP·Filed 2015·Granted Feb 27, 2018·1 cites·20 claims
- 3166US7528483B2Cooling system for a semiconductor device and method of fabricating sameIBM·Filed 2006·Granted May 5, 2009·2 cites·12 claims
- 3265US7335599B2Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrateIBM·Filed 2005·Granted Feb 26, 2008·2 cites·7 claims
- 3362US7086020B2Circuits and methods for matching device characteristics for analog and mixed-signal designsIBM·Filed 2003·Granted Aug 1, 2006·8 cites·31 claims
- 3461US7947566B2Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrateIBM·Filed 2008·Granted May 24, 2011·1 cites·13 claims
- 3561US2008170368A1Apparatuses for Dissipating Heat from Semiconductor DevicesIBM·Filed 2008·Application pending·0 cites
- 3658US10884735B2Instruction and logic for predication and implicit destinationINTEL CORP·Filed 2018·Granted Jan 5, 2021·0 cites·20 claims
- 3756US6910165B2Digital random noise generatorIBM·Filed 2001·Granted Jun 21, 2005·7 cites·19 claims
- 3855US6865722B2Method of automating chip power consumption estimation calculationIBM·Filed 2002·Granted Mar 8, 2005·5 cites·20 claims
- 3954US8004097B2Carrier wafer having alignment keys and supporting a chipIBM·Filed 2008·Granted Aug 23, 2011·0 cites·7 claims
- 4053US8189419B2Apparatus for nonvolatile multi-programmable electronic fuse systemCHEN HOWARD H·Filed 2009·Granted May 29, 2012·2 cites·21 claims
- 4153US7675789B2Programmable heavy-ion sensing device for accelerated DRAM soft error detectionIBM·Filed 2008·Granted Mar 9, 2010·2 cites·7 claims
- 4251US7442579B2Methods to achieve precision alignment for wafer scale packagesIBM·Filed 2004·Granted Oct 28, 2008·3 cites·30 claims
- 4350US8138085B2Laser annealing for 3-D chip integrationCHEN HOWARD H·Filed 2011·Granted Mar 20, 2012·0 cites·8 claims
- 4447US2016179538A1Method and apparatus for implementing and maintaining a stack of predicate values with stack synchronization instructions in an out of order hardware software co-designed processorINTEL CORP·Filed 2014·Application pending·0 cites
- 4546US2007018239A1Sea-of-fins structure on a semiconductor substrate and method of fabricationIBM·Filed 2005·Application pending·0 cites
- 4642US9916164B2Methods and apparatus to optimize instructions for execution by a processorINTEL CORP·Filed 2015·Granted Mar 13, 2018·0 cites·21 claims
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