Apparatuses for Dissipating Heat from Semiconductor Devices

Abstract

An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having a base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped members have interior and exterior sidewalls, the 3D-shaped members being connected to the base section so that vapor carrying latent heat can reach the respective interior sidewalls and get transferred to the respective exterior sidewalls configured to be in contact with an external coolant. The vapor chamber is configured to be in contact with a semiconductor device in order to remove heat therefrom.

1 . An apparatus for providing two-phase heat transfer for semiconductor devices, comprising:
 a vapor chamber configured to carry a cooling liquid, the vapor chamber having a base section, and a plurality of three-dimensional (3D) shaped members;   the plurality of 3D-shaped members having interior and exterior sidewalls, the 3D-shaped members being connected to the base section so that vapor carrying latent heat can reach the respective interior sidewalls and get transferred to the respective exterior sidewalls configured to be in contact with an external coolant; and   the vapor chamber being configured to be in contact with a semiconductor device in order to remove heat therefrom.   
   
   
       2 . The apparatus of  claim 1 , wherein the vapor chamber is partially filled with the cooling liquid. 
   
   
       3 . The apparatus of  claim 1 , wherein the vapor chamber is a wick-assisted vapor chamber having a capillary mechanism configured to deliver condensed liquid from the 3D-shaped members to the base section. 
   
   
       4 . The apparatus of  claim 3 , wherein the wick-assisted vapor chamber comprises a first plurality of parallel wick structures which travel from the base section of the vapor chamber to one or more top interior portions of the base chamber and a second plurality of parallel wick structures which travel from the base section of the vapor chamber to one or more top interior portions of the plurality of 3D-shaped members. 
   
   
       5 . The apparatus of  claim 3 , wherein the capillary mechanism operates at all gravitational orientations. 
   
   
       6 . The apparatus of  claim 3 , wherein the wick-assisted vapor chamber together with cooling achieved by the cooling liquid provides an enhanced two-phase heat transfer. 
   
   
       7 . The apparatus of  claim 3 , wherein the wick-assisted vapor chamber is made of one of a metal, non-metal meshes, or fiber bundles. 
   
   
       8 . The apparatus of  claim 1 , wherein the 3D-shaped members comprise fin-shaped members configured to increase the surface area of the vapor chamber thereby improving two-phase cooling efficiency. 
   
   
       9 . The apparatus of  claim 8 , wherein the fin-shaped members are at least one of a triangular prism, a rectangular prism, a pyramid, a cone, and a cylinder. 
   
   
       10 . The apparatus of  claim 8 , wherein the cooling liquid comprises a liquid-phase material having a reduced boiling temperature such that the liquid-phase material is evaporated by absorption of heat from the semiconductor device and condensed by cooling of the fin-shaped members. 
   
   
       11 . The apparatus of  claim 10 , wherein the cooling comprises air-cooling together with liquid-cooling. 
   
   
       12 . An apparatus for removing excessive heat from semiconductor devices, comprising:
 a vapor chamber configured to carry a cooling liquid, the vapor chamber having a base section, and a plurality of three-dimensional (3D) shaped members;   the plurality of 3D-shaped members having interior and exterior sidewalls, the 3D-shaped members being connected to the base section so that vapor carrying latent heat can reach the respective interior sidewalls and transfer to the respective exterior sidewalls;   a conduit having fast and second ends and carrying a coolant, the conduit disposed to be in contact with the 3D-shaped members and configured to transfer heat from the exterior sidewalls of the 3D-shaped members to the coolant flowing through the conduit; and   the vapor chamber being configured to be in contact with a semiconductor device in order to remove heat from the semiconductor device.   
   
   
       13 . The apparatus of  claim 12 , wherein the vapor chamber is partially filled with the cooling liquid. 
   
   
       14 . The apparatus of  claim 12 , wherein the vapor chamber is a wick-assisted vapor chamber having a capillary mechanism configured to deliver condensed liquid from the 3D-shaped members to the base section. 
   
   
       15 . The apparatus of  claim 14 , wherein the wick-assisted vapor chamber together with cooling achieved by the cooling liquid provides an enhanced two-phase heat transfer. 
   
   
       16 . The apparatus of  claim 14 , wherein the wick-assisted vapor chamber is made of one of a metal, non-metal meshes, or fiber bundles. 
   
   
       17 . The apparatus of  claim 12 , wherein the 3D-shaped members comprise fin-shaped members configured to increase the surface area of the vapor chamber thereby improving two-phase cooling efficiency. 
   
   
       18 . The apparatus of  claim 17 , wherein the fin-shaped members are at least one of a triangular prism, a rectangular prism, a pyramid, a cone, and a cylinder. 
   
   
       19 . The apparatus of  claim 17 , wherein the cooling liquid comprises a liquid-phase material having a reduced boiling temperature such that the liquid-phase material is evaporated by absorption of heat from the semiconductor device and condensed by cooling facilitated by the fin-shaped members. 
   
   
       20 . The apparatus of  claim 12 , wherein the base section in contact with the semiconductor device has a length that is greater than a length of the semiconductor device. 
   
   
       21 . An apparatus for removing heat from a semiconductor device, comprising:
 a solid heat sink;   a vapor chamber in thermal contact with the heat sink on one side and the semiconductor device on an opposite side, each of the heat sink and the vapor chamber having a plurality of three-dimensional (3D) shaped members; and   wherein the vapor chamber is filled with a coolant to a level so as to cover an entire surface of the semiconductor device.   
   
   
       22 . The apparatus of  claim 21 , wherein the coolant is heated by heat generated by the semiconductor device and generated vapors are subject to condensation via cooling effect of the heat sink thereby causing a reduction in the temperature of the semiconductor device. 
   
   
       23 . The apparatus of  claim 21 , wherein the semiconductor device is vertically mounted on a chip carrier. 
   
   
       24 . A cooling apparatus for removing heat from a semiconductor device, comprising:
 a vapor chamber in thermal contact with a semiconductor device, the vapor chamber having a plurality of three-dimensional (3D) shaped members, the vapor chamber configured to extend beyond a length of the semiconductor device; and   a thermally-conductive material coated as a porous film on a side surface of the vapor chamber, the side surface being in thermal contact with the semiconductor device,   wherein the vapor chamber if filled with a coolant to a level so as to cover an entire surface of the semiconductor device.   
   
   
       25 . The apparatus of  claim 24 , wherein the semiconductor device is vertically mounted on a chip carrier.