Inventor · disambiguated record
Hsichang Liu
Also filed as: LIU HSICHANG
18 granted patents·5 pending applications·153 citations·filing 1997–2013
93Inventor score
Top patents by PatentIndex Score
23 records- 0198US7369410B2Apparatuses for dissipating heat from semiconductor devicesIBM·Filed 2006·Granted May 6, 2008·101 cites·4 claims
- 0277US7836935B2Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersIBM·Filed 2008·Granted Nov 23, 2010·3 cites·4 claims
- 0372US8232636B2Reliability enhancement of metal thermal interfaceHUMENIK JAMES N·Filed 2010·Granted Jul 31, 2012·5 cites·24 claims
- 0470US7302757B2Micro-bumps to enhance LGA interconnectionsIBM·Filed 2005·Granted Dec 4, 2007·6 cites·10 claims
- 0569US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 0666US7287468B2Nickel alloy plated structureIBM·Filed 2005·Granted Oct 30, 2007·3 cites·26 claims
- 0761US2008170368A1Apparatuses for Dissipating Heat from Semiconductor DevicesIBM·Filed 2008·Application pending·0 cites
- 0857US7472650B2Nickel alloy plated structureIBM·Filed 2007·Granted Jan 6, 2009·1 cites·12 claims
- 0955US6838009B2Rework method for finishing metallurgy on chip carriersIBM·Filed 2001·Granted Jan 4, 2005·6 cites·5 claims
- 1055US6348233B2Method of forming conductive line features for enhanced reliability of multi-layer ceramic substratesIBM·Filed 2001·Granted Feb 19, 2002·7 cites·9 claims
- 1153US8910853B2Additives for grain fragmentation in Pb-free Sn-based solderIBM·Filed 2013·Granted Dec 16, 2014·0 cites·17 claims
- 1252US7947143B2Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersIBM·Filed 2008·Granted May 24, 2011·0 cites·4 claims
- 1351US6662718B2Screening mask having a stress-relieving areaIBM·Filed 2001·Granted Dec 16, 2003·2 cites·16 claims
- 1447US7078320B2Partial wafer bonding and dicingIBM·Filed 2004·Granted Jul 18, 2006·2 cites·26 claims
- 1547US2007113950A1Method and apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersIBM·Filed 2005·Application pending·0 cites
- 1646US8156990B2Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriersBUNT JAY A·Filed 2008·Granted Apr 17, 2012·0 cites·5 claims
- 1746US7683493B2Intermetallic diffusion block device and method of manufactureIBM·Filed 2008·Granted Mar 23, 2010·0 cites·7 claims
- 1843US2006243700A1Composite electroformed screening mask and method of making the sameIBM·Filed 2005·Application pending·0 cites
- 1941US2006145356A1On-chip coolingIBM·Filed 2005·Application pending·0 cites
- 2039US5935404AMethod of performing processes on features with electricityIBM·Filed 1997·Granted Aug 10, 1999·7 cites·10 claims
- 2136US6217989B1Conductive line features for enhanced reliability of multi-layer ceramic substratesIBM·Filed 1999·Granted Apr 17, 2001·6 cites·25 claims
- 2235US2005221635A1Micro-bumps to enhance lga interconnectionsIBM·Filed 2004·Application pending·0 cites
- 2332US5985128AMethod of performing processes on features with electricityIBM·Filed 1999·Granted Nov 16, 1999·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →