P

Inventor

LEE CHANG-SUP

KR25 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHANG-SUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

17 patents
US10211154B2Feb 19, 2019

Three-dimensional semiconductor device

SAMSUNG ELECTRONICS CO LTD9 citations83
US10886289B2Jan 5, 2021

Integrated circuit device including vertical memory device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD3 citations73
US10644023B2May 5, 2020

Three-dimensional semiconductor memory device including stacked electrodes having pad portions

SAMSUNG ELECTRONICS CO LTD2 citations73
US11107765B2Aug 31, 2021

Three-dimensional semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations72
US10629609B2Apr 21, 2020

Three dimensional semiconductor device and method of forming the same

SAMSUNG ELECTRONICS CO LTD2 citations72
US10658374B2May 19, 2020

Vertical semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations70
US10297543B2May 21, 2019

Vertical semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations70
USRE50547EAug 19, 2025

Integrated circuit device including vertical memory device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12317492B2May 27, 2025

Three-dimensional semiconductor memory device with increased process margin

SAMSUNG ELECTRONICS CO LTD0 citations62
US12183677B2Dec 31, 2024

Three-dimensional semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
USRE50225ENov 26, 2024

Integrated circuit device including vertical memory device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11910614B2Feb 20, 2024

Three dimensional semiconductor device and method of forming the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US11854975B2Dec 26, 2023

Three-dimensional semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11374019B2Jun 28, 2022

Three-dimensional semiconductor memory device including an electrode connecting portion

SAMSUNG ELECTRONICS CO LTD0 citations62
US11296104B2Apr 5, 2022

Three dimensional semiconductor device and method of forming the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US11309326B2Apr 19, 2022

Vertical semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations59
US12581930B2Mar 17, 2026

Semiconductor device including electrodes each having a pad part and electronic system including the same

SAMSUNG ELECTRONICS CO LTD0 citations49

LEE CHANG SUP

7 patents

KANG SHIN HWAN

1 patent