Inventor · disambiguated record
Shijian Luo
Also filed as: LUO SHIJIAN
50 granted patents·16 pending applications·213 citations·filing 2003–2024
98Inventor score
Files withMICRON TECHNOLOGY INC39AXCELIS TECH INC4BOE TECHNOLOGY GROUP CO LTD4SEMIGEAR INC4LAM RES CORP3
Top patents by PatentIndex Score
66 records- 0197US10461059B2Stacked semiconductor die assemblies with improved thermal performance and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 29, 2019·22 cites·20 claims
- 0294US9899293B2Semiconductor device packages with improved thermal management and related methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 20, 2018·9 cites·20 claims
- 0394US9543274B2Semiconductor device packages with improved thermal management and related methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·9 cites·14 claims
- 0493US9070656B2Underfill-accommodating heat spreaders and related semiconductor device assemblies and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 30, 2015·21 cites·20 claims
- 0592US9153520B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsGROOTHUIS STEVEN K·Filed 2012·Granted Oct 6, 2015·17 cites·21 claims
- 0691US7592691B2High density stacked die assemblies, structures incorporated therein and methods of fabricating the assembliesMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 22, 2009·19 cites·33 claims
- 0789US9269646B2Semiconductor die assemblies with enhanced thermal management and semiconductor devices including sameLUO SHIJIAN·Filed 2012·Granted Feb 23, 2016·12 cites·28 claims
- 0887US9269700B2Stacked semiconductor die assemblies with improved thermal performance and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 23, 2016·7 cites·21 claims
- 0986US10134655B2Semiconductor device packages with direct electrical connections and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 20, 2018·3 cites·20 claims
- 1086US9865578B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 9, 2018·4 cites·21 claims
- 1184US2024222145A1Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1283US10622223B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 14, 2020·2 cites·15 claims
- 1383US10170389B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 1, 2019·3 cites·16 claims
- 1483US9472531B2Device packaging facility and method, and device processing apparatus utilizing phthalateSEMIGEAR INC·Filed 2015·Granted Oct 18, 2016·4 cites·15 claims
- 1582US10763131B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 1, 2020·2 cites·16 claims
- 1681US10103134B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·2 cites·20 claims
- 1780US2024387441A1Use of pre-channeled materials for anisotropic conductorsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1879US7663381B2Electrical condition monitoring method for polymersWATKINS JR KENNETH S·Filed 2008·Granted Feb 16, 2010·8 cites·17 claims
- 1979US7411297B2Microfeature devices and methods for manufacturing microfeature devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 12, 2008·6 cites·21 claims
- 2079US7199037B2Microfeature devices and methods for manufacturing microfeature devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 3, 2007·6 cites·20 claims
- 2176US11004697B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted May 11, 2021·1 cites·15 claims
- 2275US11955346B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 2375US10741468B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 11, 2020·1 cites·11 claims
- 2475US6885108B2Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking thereinMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 26, 2005·16 cites·33 claims
- 2574US8816494B2Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packagesGROOTHUIS STEVEN·Filed 2012·Granted Aug 26, 2014·4 cites·30 claims
- 2674US7414416B2Electrical condition monitoring method for polymersPOLYMER AGING CONCEPTS INC·Filed 2003·Granted Aug 19, 2008·14 cites·45 claims
- 2773US12051670B2Use of pre-channeled materials for anisotropic conductorsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 2872US12494444B2Semiconductor device with tunable antenna using wire bondsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 2971US11594462B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 28, 2023·0 cites·15 claims
- 3071US11410973B2Microelectronic device assemblies and packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·24 claims
- 3171US10748857B2Die features for self-alignment during die bondingMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 18, 2020·1 cites·16 claims
- 3270US9157014B2Adhesives including a filler material and related methodsMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 13, 2015·2 cites·27 claims
- 3368US10990062B2Display systemBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Apr 27, 2021·2 cites·8 claims
- 3468US9824998B2Device packaging facility and method, and device processing apparatus utilizing DEHTSEMIGEAR INC·Filed 2016·Granted Nov 21, 2017·1 cites·14 claims
- 3567US8492242B2Dry flux bonding device and methodFAY OWEN·Filed 2010·Granted Jul 23, 2013·3 cites·22 claims
- 3666US9741683B2Device packaging facility and method, and device processing apparatus utilizing phthalateSEMIGEAR INC·Filed 2016·Granted Aug 22, 2017·1 cites·25 claims
- 3765US10283481B2Device packaging facility and method, and device processing apparatus utilizing DEHTSEMLGEAR INC·Filed 2017·Granted May 7, 2019·1 cites·14 claims
- 3864US11302653B2Die features for self-alignment during die bondingMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 12, 2022·0 cites·16 claims
- 3964US8072055B2High density stacked die assemblies, structures incorporated therein and methods of fabricating the assembliesCORISIS DAVID J·Filed 2009·Granted Dec 6, 2011·2 cites·22 claims
- 4062US10679921B2Semiconductor device packages with direct electrical connections and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 4161US11539823B2Device and method for muffling, communication device and wearable deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Dec 27, 2022·1 cites·17 claims
- 4260US12199068B2Methods of forming microelectronic device assemblies and packagesMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 14, 2025·0 cites·8 claims
- 4360US11139262B2Use of pre-channeled materials for anisotropic conductorsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 5, 2021·0 cites·19 claims
- 4460US7199464B2Semiconductor device structures including protective layers formed from healable materialsMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 3, 2007·1 cites·31 claims
- 4559US10937757B2Device packaging facility and method, and device processing apparatus utilizing DEHTSEMIGEAR INC·Filed 2019·Granted Mar 2, 2021·0 cites·9 claims
- 4657US11251516B2Semiconductor device with tunable antenna using wire bondsMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 15, 2022·0 cites·20 claims
- 4756US7417305B2Electronic devices at the wafer level having front side and edge protection material and systems including the devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 26, 2008·5 cites·17 claims
- 4855US9184105B2Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packagesMICRON TECHNOLOGY INC·Filed 2014·Granted Nov 10, 2015·0 cites·20 claims
- 4955US2011136346A1Substantially Non-Oxidizing Plasma Treatment Devices and ProcessesAXCELIS TECH INC·Filed 2009·Application pending·0 cites
- 5053US2014076353A1Plasma mediated ashing processesLAM RES CORP·Filed 2013·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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