Inventor · disambiguated record
Chih-Yeh Lin
Also filed as: LIN CHIH-YEH
7 granted patents·13 pending applications·4 citations·filing 2010–2021
73Inventor score
Top patents by PatentIndex Score
20 records- 0176US11033949B2Method of manufacturing a heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2017·Granted Jun 15, 2021·1 cites·20 claims
- 0273US11065671B2Method of manufacturing a heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2017·Granted Jul 20, 2021·1 cites·2 claims
- 0365US10890382B2Heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2017·Granted Jan 12, 2021·1 cites·5 claims
- 0461US11033989B2Jig structure for manufacturing heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2018·Granted Jun 15, 2021·0 cites·6 claims
- 0561US9389656B2Heat dissipation structure applied to mobile deviceASIA VITAL COMPONENTS CO LTD·Filed 2014·Granted Jul 12, 2016·1 cites·10 claims
- 0657US2021381777A1Method of manufacturing a heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2021·Application pending·0 cites
- 0753US2015219410A1Heat Dissipation Structure Enhancing Heat Source Self Heat RadiationASIA VITAL COMPONENTS CO LTD·Filed 2014·Application pending·0 cites
- 0848US2013306275A1Heat dissipation structure for heat dissipation deviceYANG HSIU-WEI·Filed 2012·Application pending·0 cites
- 0945US2020023422A1Heat dissipation component manufacturing methodASIA VITAL COMPONENTS CO LTD·Filed 2018·Application pending·0 cites
- 1045US2020025461A1Method of manufacturing heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2018·Application pending·0 cites
- 1144US2018369971A1Method of manufacturing a heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2017·Application pending·0 cites
- 1243US11029097B2Heat dissipation componentASIA VITAL COMPONENTS CO LTD·Filed 2018·Granted Jun 8, 2021·0 cites·4 claims
- 1343US2018361505A1Manufacturing method of heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2017·Application pending·0 cites
- 1442US9470459B2Support structure for heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Oct 18, 2016·0 cites·5 claims
- 1542US2015221576A1Heat Dissipation Structure for Semiconductor ElementASIA VITAL COMPONENTS CO LTD·Filed 2014·Application pending·0 cites
- 1642US2015219406A1Heat Dissipation DeviceASIA VITAL COMPONENTS CO LTD·Filed 2014·Application pending·0 cites
- 1738US2013306274A1Heat dissipation structure for heat dissipation unitYANG HSIU-WEI·Filed 2012·Application pending·0 cites
- 1837US2014174704A1Heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2012·Application pending·0 cites
- 1935US2018372431A1Heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2017·Application pending·0 cites
- 2029US2011140961A1Mobile phone cradle with GPS and Bluetooth functionalityYEH CHEN-CHEN·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →