Inventor · disambiguated record
Aaron Berke
Also filed as: BERKE AARON
16 granted patents·6 pending applications·63 citations·filing 2014–2024
91Inventor score
Files withLAM RES CORP22
Top patents by PatentIndex Score
22 records- 0196US12157949B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2023·Granted Dec 3, 2024·1 cites·14 claims
- 0296US9567685B2Apparatus and method for dynamic control of plated uniformity with the use of remote electric currentLAM RES CORP·Filed 2015·Granted Feb 14, 2017·11 cites·18 claims
- 0395US10364505B2Dynamic modulation of cross flow manifold during elecroplatingLAM RES CORP·Filed 2016·Granted Jul 30, 2019·7 cites·20 claims
- 0495US9752248B2Methods and apparatuses for dynamically tunable wafer-edge electroplatingLAM RES CORP·Filed 2014·Granted Sep 5, 2017·18 cites·20 claims
- 0592US11585007B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2019·Granted Feb 21, 2023·2 cites·7 claims
- 0692US9988733B2Apparatus and method for modulating azimuthal uniformity in electroplatingLAM RES CORP·Filed 2015·Granted Jun 5, 2018·3 cites·11 claims
- 0790US10053793B2Integrated elastomeric lipseal and cup bottom for reducing wafer stickingLAM RES CORP·Filed 2015·Granted Aug 21, 2018·6 cites·11 claims
- 0888US11001934B2Methods and apparatus for flow isolation and focusing during electroplatingLAM RES CORP·Filed 2018·Granted May 11, 2021·6 cites·20 claims
- 0988US2025051953A1Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2024·Application pending·0 cites
- 1087US11047059B2Dynamic modulation of cross flow manifold during elecroplatingLAM RES CORP·Filed 2019·Granted Jun 29, 2021·1 cites·15 claims
- 1186US10982346B2Integrated elastomeric lipseal and cup bottom for reducing wafer stickingLAM RES CORP·Filed 2018·Granted Apr 20, 2021·3 cites·16 claims
- 1283US10014170B2Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivityLAM RES CORP·Filed 2015·Granted Jul 3, 2018·3 cites·17 claims
- 1373US10781527B2Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplatingLAM RES CORP·Filed 2017·Granted Sep 22, 2020·2 cites·13 claims
- 1466US2018312991A1Apparatus and method for modulating azimuthal uniformity in electroplatingLAM RES CORP·Filed 2018·Application pending·0 cites
- 1563US11655556B2Flow assisted dynamic seal for high-convection, continuous-rotation platingLAM RES CORP·Filed 2020·Granted May 23, 2023·0 cites·18 claims
- 1658US10923340B2Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivityLAM RES CORP·Filed 2018·Granted Feb 16, 2021·0 cites·22 claims
- 1758US10612151B2Flow assisted dynamic seal for high-convection, continuous-rotation platingLAM RES CORP·Filed 2018·Granted Apr 7, 2020·0 cites·14 claims
- 1846US10969036B2High flow multi-way piston valve for deposition systemsLAM RES CORP·Filed 2018·Granted Apr 6, 2021·0 cites·10 claims
- 1945US2018251907A1Wide lipseal for electroplatingLAM RES CORP·Filed 2017·Application pending·0 cites
- 2045US2018258546A1Electroplating apparatus and methods utilizing independent control of impinging electrolyteLAM RES CORP·Filed 2017·Application pending·0 cites
- 2142US2017073832A1Durable low cure temperature hydrophobic coating in electroplating cup assemblyLAM RES CORP·Filed 2016·Application pending·0 cites
- 2240US2022220627A1Substrate sticking and breakage mitigationLAM RES CORP·Filed 2020·Application pending·0 cites
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