Electroplating apparatus and methods utilizing independent control of impinging electrolyte

Abstract

Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the substrate. During plating, fluid may enter the cross flow manifold upward through the channels in the ionically resistive element, and (optionally) laterally through a cross flow side inlet. The flow paths combine in the cross flow manifold and exit at the cross flow outlet, which may be positioned opposite the cross flow inlet. In some embodiments, the ionically resistive element may include two or more flow regions, where the flow through each flow region is independently controllable. In these or other embodiments, an electrolyte jet may be included to flow additional electrolyte toward the substrate at a particular radial location or locations during plating. In some embodiments, the ionically resistive element may be omitted.

What is claimed is: 
     
         1 . An electroplating apparatus comprising:
 an electroplating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate, the substrate being substantially planar;   an inlet for introducing electrolyte to the electroplating chamber;   an outlet for removing electrolyte from the electroplating chamber;   a substrate holder configured to hold the substrate such that a plating face of the substrate is separated from the anode during electroplating; and   an electrolyte jet configured to deliver electrolyte toward the plating face of the substrate in a non-uniform manner, wherein a flow rate through the electrolyte jet and a total flow rate through the electroplating chamber are independently controllable.   
     
     
         2 . The apparatus of  claim 1 , wherein the electrolyte jet is an edge jet configured to deliver the electrolyte such that it preferentially impinges upon a peripheral region of the substrate. 
     
     
         3 . The apparatus of  claim 1 , wherein the electrolyte jet is an inner jet configured to deliver electrolyte such that it preferentially impinges upon a non-peripheral region of the substrate. 
     
     
         4 . The apparatus of  claim 1 , wherein the electrolyte jet comprises a plurality of individual jets. 
     
     
         5 . The apparatus of  claim 4 , wherein at least two of the plurality of individual jets of the electrolyte jet are positioned to deliver electrolyte at different radial locations. 
     
     
         6 . The apparatus of  claim 5 , wherein a first individual jet of the plurality of electrolyte jets is configured to deliver electrolyte at a peripheral region of the substrate, and wherein a second individual jet of the plurality of electrolyte jets is configured to deliver electrolyte at a non-peripheral region of the substrate. 
     
     
         7 . The apparatus of  claim 4 , wherein the electrolyte jet is divided into at least a first region and a second region, each of the first and second regions of the electrolyte jet being supplied electrolyte from a distinct electrolyte source, and each of the first and second regions of the electrolyte jet comprising at least one of the plurality of individual jets, wherein a first flow rate through the first region of the electrolyte jet is independently controllable from a second flow rate through the second region of the electrolyte jet. 
     
     
         8 . The apparatus of  claim 4 , wherein the electrolyte jet is provided at a particular azimuthal location or locations such that as the substrate rotates, an area on the plating face of the substrate is cyclically exposed to (i) regions where the electrolyte jet is present and (ii) regions where the electrolyte jet is absent. 
     
     
         9 . The apparatus of  claim 8 , wherein within regions where the electrolyte jet is present, the electrolyte jet delivers electrolyte at different radial locations, wherein the flow rate of electrolyte through the electrolyte jet is non-uniform at the different radial locations. 
     
     
         10 . The apparatus of  claim 1 , wherein the electrolyte jet is configured to direct electrolyte toward the substrate at a normal angle with respect to the plating face of the substrate. 
     
     
         11 . The apparatus of  claim 1 , wherein the electrolyte jet is configured to direct electrolyte toward the substrate at a non-normal angle with respect to the plating face of the substrate. 
     
     
         12 . The apparatus of  claim 11 , wherein the electrolyte jet comprises at least one individual jet that is angled radially inwards. 
     
     
         13 . The apparatus of  claim 1 , further comprising a jet manifold that supplies electrolyte to the electrolyte jet. 
     
     
         14 . The apparatus of  claim 13 , further comprising
 an ionically resistive element including a substrate-facing surface that is separated from the plating face of the substrate by a gap, the gap forming a cross flow manifold, wherein the ionically resistive element is at least coextensive with the plating face of the substrate during electroplating, the ionically resistive element adapted to provide electrolyte transport and ionic transport through the ionically resistive element during electroplating;   a side outlet to the cross flow manifold for receiving electrolyte flowing in the cross flow manifold; and   an ionically resistive element manifold that supplies electrolyte below the ionically resistive element, wherein the ionically resistive element manifold and the jet manifold are separated from one another.   
     
     
         15 . The apparatus of  claim 13 , further comprising
 an ionically resistive element including a substrate-facing surface that is separated from the plating face of the substrate by a gap, the gap forming a cross flow manifold, wherein the ionically resistive element is at least coextensive with the plating face of the substrate during electroplating, the ionically resistive element adapted to provide electrolyte transport and ionic transport through the ionically resistive element during electroplating;   a side inlet to the cross flow manifold for introducing electrolyte to the cross flow manifold;   a side outlet to the cross flow manifold for receiving electrolyte flowing in the cross flow manifold; and   a cross flow injection manifold, wherein the side inlet and the side outlet are positioned proximate azimuthally opposing perimeter locations on the plating face of the substrate during electroplating, wherein the cross flow injection manifold supplies electrolyte to the side inlet, and wherein the jet manifold and the cross flow injection manifold are separated from one another.   
     
     
         16 . The apparatus of  claim 1 , further comprising an edge flow element positioned proximate a periphery of the substrate and at least partially radially inside of a corner formed at an interface between the substrate and the substrate holder, wherein the edge flow element is configured to direct electrolyte into the corner formed at the interface between the substrate and the substrate holder, the edge flow element being ring-shaped or arc-shaped. 
     
     
         17 . The apparatus of  claim 1 , further comprising
 an ionically resistive element including a substrate-facing surface that is separated from the plating face of the substrate by a gap, the gap forming a cross flow manifold, wherein the ionically resistive element is at least coextensive with the plating face of the substrate during electroplating, the ionically resistive element adapted to provide electrolyte transport and ionic transport through the ionically resistive element during electroplating;   
       wherein the electrolyte jet comprises a channel that extends from a first location to a second location, the first location being positioned below a plane formed by the substrate-facing surface of the ionically resistive element, and the second location being positioned at or above the plane formed by the substrate-facing surface of the ionically resistive element. 
     
     
         18 . An electroplating apparatus comprising:
 (a) an electroplating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate, the substrate being substantially planar;   (b) a substrate holder configured to hold the substrate such that a plating face of the substrate is separated from the anode during electroplating;   (c) an ionically resistive element comprising:
 (i) a substrate-facing surface that is separated from the plating face of the substrate by a gap, the gap forming a cross flow manifold, 
 (ii) a first flow region and a second flow region, wherein each of the first and second flow regions allow for transport of an electrolyte through the ionically resistive element during electroplating, 
 wherein the ionically resistive element is at least coextensive with the plating face of the substrate during electroplating, the ionically resistive element adapted to provide ionic transport through the ionically resistive element during electroplating; 
   (d) an ionically resistive element manifold positioned below the ionically resistive element, the ionically resistive element manifold comprising a first electrolyte source region and a second electrolyte source region, the first and second electrolyte source regions being separated from one another, wherein the first electrolyte source region supplies electrolyte to the first flow region of the ionically resistive element and the second electrolyte source region supplies electrolyte to the second flow region of the ionically resistive element, and wherein a flow of electrolyte through the first flow region is independently controllable from a flow of electrolyte through the second flow region; and   (e) a side outlet to the cross flow manifold for receiving electrolyte flowing in the cross flow manifold.   
     
     
         19 . An electrolyte jet assembly for use in an electroplating apparatus, the electrolyte jet assembly comprising:
 a frame comprising a portion that is ring-shaped or arc-shaped, the frame being configured to engage with a substrate holder and/or an ionically resistive element of the electroplating apparatus; and   a plurality of jets positioned on the frame, each jet comprising a channel through which electrolyte flows during electroplating, wherein the jets are configured to deliver impinging electrolyte on a plating face of a substrate supported in the substrate holder during electroplating.