Inventor · disambiguated record
Lee Peng Chua
Also filed as: CHUA LEE PENG
26 granted patents·8 pending applications·148 citations·filing 2008–2024
95Inventor score
Top patents by PatentIndex Score
34 records- 0196US12157949B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2023·Granted Dec 3, 2024·1 cites·14 claims
- 0296US10094034B2Edge flow element for electroplating apparatusLAM RES CORP·Filed 2015·Granted Oct 9, 2018·11 cites·14 claims
- 0396US9567685B2Apparatus and method for dynamic control of plated uniformity with the use of remote electric currentLAM RES CORP·Filed 2015·Granted Feb 14, 2017·11 cites·18 claims
- 0494US10233556B2Dynamic modulation of cross flow manifold during electroplatingLAM RES CORP·Filed 2016·Granted Mar 19, 2019·7 cites·19 claims
- 0594US9534308B2Protecting anodes from passivation in alloy plating systemsNOVELLUS SYSTEMS INC·Filed 2013·Granted Jan 3, 2017·5 cites·12 claims
- 0693US9221081B1Automated cleaning of wafer plating assemblyMAYER STEVEN T·Filed 2012·Granted Dec 29, 2015·13 cites·27 claims
- 0792US11585007B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2019·Granted Feb 21, 2023·2 cites·7 claims
- 0892US10106907B2Protecting anodes from passivation in alloy plating systemsNOVELLUS SYSTEMS INC·Filed 2016·Granted Oct 23, 2018·2 cites·19 claims
- 0992US9988733B2Apparatus and method for modulating azimuthal uniformity in electroplatingLAM RES CORP·Filed 2015·Granted Jun 5, 2018·3 cites·11 claims
- 1092US9476139B2Cleaning electroplating substrate holders using reverse current deplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Oct 25, 2016·10 cites·29 claims
- 1192US8288288B1Transferring heat in loadlocksGAGE CHRISTOPHER·Filed 2008·Granted Oct 16, 2012·32 cites·18 claims
- 1291US9359688B1Apparatuses and methods for controlling PH in electroplating bathsNOVELLUS SYSTEMS INC·Filed 2012·Granted Jun 7, 2016·5 cites·15 claims
- 1390US10053793B2Integrated elastomeric lipseal and cup bottom for reducing wafer stickingLAM RES CORP·Filed 2015·Granted Aug 21, 2018·6 cites·11 claims
- 1489US10954605B2Protecting anodes from passivation in alloy plating systemsNOVELLUS SYSTEMS INC·Filed 2018·Granted Mar 23, 2021·1 cites·15 claims
- 1589US10094035B1Convection optimization for mixed feature electroplatingLAM RES CORP·Filed 2017·Granted Oct 9, 2018·14 cites·19 claims
- 1688US2025051953A1Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2024·Application pending·0 cites
- 1787US9613833B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2014·Granted Apr 4, 2017·7 cites·15 claims
- 1886US10982346B2Integrated elastomeric lipseal and cup bottom for reducing wafer stickingLAM RES CORP·Filed 2018·Granted Apr 20, 2021·3 cites·16 claims
- 1984US10087545B2Automated cleaning of wafer plating assemblyNOVELLUS SYSTEMS INC·Filed 2015·Granted Oct 2, 2018·3 cites·22 claims
- 2083US10092933B2Methods and apparatuses for cleaning electroplating substrate holdersNOVELLUS SYSTEMS INC·Filed 2013·Granted Oct 9, 2018·6 cites·27 claims
- 2183US10014170B2Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivityLAM RES CORP·Filed 2015·Granted Jul 3, 2018·3 cites·17 claims
- 2279US10128102B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2017·Granted Nov 13, 2018·2 cites·20 claims
- 2371US10538855B2Cleaning electroplating substrate holders using reverse current deplatingNOVELLUS SYSTEMS INC·Filed 2016·Granted Jan 21, 2020·1 cites·4 claims
- 2466US11542630B2Cleaning electroplating substrate holders using reverse current deplatingNOVELLUS SYSTEMS INC·Filed 2019·Granted Jan 3, 2023·0 cites·10 claims
- 2566US2018312991A1Apparatus and method for modulating azimuthal uniformity in electroplatingLAM RES CORP·Filed 2018·Application pending·0 cites
- 2658US10923340B2Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivityLAM RES CORP·Filed 2018·Granted Feb 16, 2021·0 cites·22 claims
- 2758US2024076795A1Spatially and dimensionally non-uniform channelled plate for tailored hydrodynamics during electroplatingLAM RES CORP·Filed 2022·Application pending·0 cites
- 2857US2024200223A1Control of dissolved gas concentration in electroplating bathsLAM RES CORP·Filed 2022·Application pending·0 cites
- 2951US12241173B2Wafer shielding for prevention of lipseal plate-outLAM RES CORP·Filed 2020·Granted Mar 4, 2025·0 cites·25 claims
- 3051US2024141541A1Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrateLAM RES CORP·Filed 2022·Application pending·0 cites
- 3145US12293943B2Gold through silicon mask platingLAM RES CORP·Filed 2020·Granted May 6, 2025·0 cites·12 claims
- 3245US2018251907A1Wide lipseal for electroplatingLAM RES CORP·Filed 2017·Application pending·0 cites
- 3345US2018258546A1Electroplating apparatus and methods utilizing independent control of impinging electrolyteLAM RES CORP·Filed 2017·Application pending·0 cites
- 3442US2017073832A1Durable low cure temperature hydrophobic coating in electroplating cup assemblyLAM RES CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →