Inventor · disambiguated record
Bryan L. Buckalew
Also filed as: BUCKALEW BRYAN · BUCKALEW BRYAN L
75 granted patents·20 pending applications·723 citations·filing 2003–2024
99Inventor score
Files withLAM RES CORP54NOVELLUS SYSTEMS INC29ANTONELLI GEORGE ANDREW2BUCKALEW BRYAN2PRABHAKAR VINAY2
Top patents by PatentIndex Score
95 records- 0198US9834852B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2016·Granted Dec 5, 2017·13 cites·20 claims
- 0297US9523155B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Dec 20, 2016·15 cites·22 claims
- 0397US9394620B2Control of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2014·Granted Jul 19, 2016·13 cites·16 claims
- 0497US8377268B2Electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2011·Granted Feb 19, 2013·19 cites·23 claims
- 0597US7985325B2Closed contact electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 26, 2011·36 cites·24 claims
- 0697US7935231B2Rapidly cleanable electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted May 3, 2011·36 cites·24 claims
- 0797US7854828B2Method and apparatus for electroplating including remotely positioned second cathodeNOVELLUS SYSTEMS INC·Filed 2006·Granted Dec 21, 2010·50 cites·20 claims
- 0896US12157949B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2023·Granted Dec 3, 2024·1 cites·14 claims
- 0996US10094034B2Edge flow element for electroplating apparatusLAM RES CORP·Filed 2015·Granted Oct 9, 2018·11 cites·14 claims
- 1096US9746427B2Detection of plating on wafer holding apparatusNOVELLUS SYSTEMS INC·Filed 2014·Granted Aug 29, 2017·9 cites·21 claims
- 1196US9567685B2Apparatus and method for dynamic control of plated uniformity with the use of remote electric currentLAM RES CORP·Filed 2015·Granted Feb 14, 2017·11 cites·18 claims
- 1296US8128791B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2006·Granted Mar 6, 2012·39 cites·24 claims
- 1395US10662545B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2017·Granted May 26, 2020·4 cites·22 claims
- 1495US10364505B2Dynamic modulation of cross flow manifold during elecroplatingLAM RES CORP·Filed 2016·Granted Jul 30, 2019·7 cites·20 claims
- 1595US9752248B2Methods and apparatuses for dynamically tunable wafer-edge electroplatingLAM RES CORP·Filed 2014·Granted Sep 5, 2017·18 cites·20 claims
- 1695US9449808B2Apparatus for advanced packaging applicationsNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 20, 2016·21 cites·23 claims
- 1795US8858774B2Electroplating apparatus for tailored uniformity profileMAYER STEVEN T·Filed 2012·Granted Oct 14, 2014·14 cites·15 claims
- 1894US10233556B2Dynamic modulation of cross flow manifold during electroplatingLAM RES CORP·Filed 2016·Granted Mar 19, 2019·7 cites·19 claims
- 1994US9899230B2Apparatus for advanced packaging applicationsNOVELLUS SYSTEMS INC·Filed 2016·Granted Feb 20, 2018·10 cites·16 claims
- 2094US9624592B2Cross flow manifold for electroplating apparatusNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 18, 2017·18 cites·24 claims
- 2194US9607822B2Pretreatment method for photoresist wafer processingLAM RES CORP·Filed 2016·Granted Mar 28, 2017·11 cites·15 claims
- 2294US9260793B2Electroplating apparatus for tailored uniformity profileNOVELLUS SYSTEMS INC·Filed 2014·Granted Feb 16, 2016·10 cites·17 claims
- 2394US9045841B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2012·Granted Jun 2, 2015·9 cites·19 claims
- 2494US8217513B2Remote plasma processing of interface surfacesANTONELLI GEORGE ANDREW·Filed 2011·Granted Jul 10, 2012·24 cites·19 claims
- 2594US8084339B2Remote plasma processing of interface surfacesANTONELLI GEORGE ANDREW·Filed 2009·Granted Dec 27, 2011·29 cites·16 claims
- 2694US7727863B1Sonic irradiation during wafer immersionNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 1, 2010·33 cites·25 claims
- 2793US10017869B2Electroplating apparatus for tailored uniformity profileNOVELLUS SYSTEMS INC·Filed 2016·Granted Jul 10, 2018·6 cites·19 claims
- 2893US8398831B2Rapidly cleanable electroplating cup sealGHONGADI SHANTINATH·Filed 2011·Granted Mar 19, 2013·18 cites·27 claims
- 2993US8308931B2Method and apparatus for electroplatingREID JONATHAN·Filed 2008·Granted Nov 13, 2012·62 cites·34 claims
- 3092US11585007B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2019·Granted Feb 21, 2023·2 cites·7 claims
- 3192US8172992B2Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2009·Granted May 8, 2012·21 cites·26 claims
- 3291US10190230B2Cross flow manifold for electroplating apparatusNOVELLUS SYSTEMS INC·Filed 2017·Granted Jan 29, 2019·6 cites·15 claims
- 3391US8500983B2Pulse sequence for plating on thin seed layersPONNUSWAMY THOMAS A·Filed 2010·Granted Aug 6, 2013·20 cites·14 claims
- 3490US9587322B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathNOVELLUS SYSTEMS INC·Filed 2015·Granted Mar 7, 2017·6 cites·16 claims
- 3590US9455139B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 27, 2016·11 cites·16 claims
- 3689US9028666B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathRANJAN MANISH·Filed 2012·Granted May 12, 2015·14 cites·28 claims
- 3788US11001934B2Methods and apparatus for flow isolation and focusing during electroplatingLAM RES CORP·Filed 2018·Granted May 11, 2021·6 cites·20 claims
- 3888US2025051953A1Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2024·Application pending·0 cites
- 3987US11047059B2Dynamic modulation of cross flow manifold during elecroplatingLAM RES CORP·Filed 2019·Granted Jun 29, 2021·1 cites·15 claims
- 4087US10211052B1Systems and methods for fabrication of a redistribution layer to avoid etching of the layerLAM RES CORP·Filed 2017·Granted Feb 19, 2019·5 cites·26 claims
- 4187US9613833B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2014·Granted Apr 4, 2017·7 cites·15 claims
- 4286US11560642B2Apparatus for an inert anode plating cellLAM RES CORP·Filed 2019·Granted Jan 24, 2023·1 cites·9 claims
- 4386US9732434B2Methods and apparatuses for electroplating nickel using sulfur-free nickel anodesLAM RES CORP·Filed 2014·Granted Aug 15, 2017·2 cites·22 claims
- 4485US9138784B1Deionized water conditioning system and methodsHawkins jeffrey alan·Filed 2010·Granted Sep 22, 2015·15 cites·8 claims
- 4585US2025019857A1Apparatus for an inert anode plating cellLAM RES CORP·Filed 2024·Application pending·0 cites
- 4684US12134831B2Apparatus for an inert anode plating cellLAM RES CORP·Filed 2022·Granted Nov 5, 2024·0 cites·11 claims
- 4783US10092933B2Methods and apparatuses for cleaning electroplating substrate holdersNOVELLUS SYSTEMS INC·Filed 2013·Granted Oct 9, 2018·6 cites·27 claims
- 4883US10014170B2Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivityLAM RES CORP·Filed 2015·Granted Jul 3, 2018·3 cites·17 claims
- 4982US9469912B2Pretreatment method for photoresist wafer processingLAM RES CORP·Filed 2014·Granted Oct 18, 2016·5 cites·7 claims
- 5081US11549192B2Electroplating apparatus for tailored uniformity profileNOVELLUS SYSTEMS INC·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →