Inventor · disambiguated record
James Isaac Fortner
Also filed as: FORTNER JAMES · FORTNER JAMES ISAAC
9 granted patents·4 pending applications·46 citations·filing 2014–2025
84Inventor score
Files withLAM RES CORP13
Top patents by PatentIndex Score
13 records- 0196US10094034B2Edge flow element for electroplating apparatusLAM RES CORP·Filed 2015·Granted Oct 9, 2018·11 cites·14 claims
- 0296US9567685B2Apparatus and method for dynamic control of plated uniformity with the use of remote electric currentLAM RES CORP·Filed 2015·Granted Feb 14, 2017·11 cites·18 claims
- 0395US9752248B2Methods and apparatuses for dynamically tunable wafer-edge electroplatingLAM RES CORP·Filed 2014·Granted Sep 5, 2017·18 cites·20 claims
- 0488US11001934B2Methods and apparatus for flow isolation and focusing during electroplatingLAM RES CORP·Filed 2018·Granted May 11, 2021·6 cites·20 claims
- 0571USD1096679SDebubbler componentLAM RES CORP·Filed 2025·Granted Oct 7, 2025·0 cites·1 claims
- 0671USD1091491SDebubbler componentLAM RES CORP·Filed 2025·Granted Sep 2, 2025·0 cites·1 claims
- 0771USD1090468SDebubbler componentLAM RES CORP·Filed 2025·Granted Aug 26, 2025·0 cites·1 claims
- 0868US10975489B2One-piece anode for tuning electroplating at an edge of a substrateLAM RES CORP·Filed 2018·Granted Apr 13, 2021·0 cites·17 claims
- 0957US2023407514A1Process kit de-bubblingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1051US2024141541A1Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrateLAM RES CORP·Filed 2022·Application pending·0 cites
- 1150US2025179680A1Gap characterization in electrodeposition toolLAM RES CORP·Filed 2023·Application pending·0 cites
- 1246US10969036B2High flow multi-way piston valve for deposition systemsLAM RES CORP·Filed 2018·Granted Apr 6, 2021·0 cites·10 claims
- 1345US2018258546A1Electroplating apparatus and methods utilizing independent control of impinging electrolyteLAM RES CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →