Inventor
BAHL KENNETH S
US24 patents
⚠️ This page may combine multiple inventors who share the name “BAHL KENNETH S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CATLAM LLC
11 patentsUS11638354B2Apr 25, 2023
Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil
CATLAM LLC2 citations72
US12513827B2Dec 30, 2025
Semi-additive process for catalytic printed circuit boards
CATLAM LLC0 citations62
US11653453B2May 16, 2023
Electroless and electrolytic deposition process for forming traces on a catalytic laminate
CATLAM LLC0 citations62
US11477893B2Oct 18, 2022
Catalytic laminate with conductive traces formed during lamination
CATLAM LLC0 citations62
US10959329B2Mar 23, 2021
Circuit board using non-catalytic laminate with catalytic adhesive overlay
CATLAM LLC0 citations62
US11406024B2Aug 2, 2022
Multi-layer circuit board with traces thicker than a circuit board
CATLAM LLC0 citations61
US11039540B2Jun 15, 2021
Multi-layer circuit board with traces thicker than a circuit board layer
CATLAM LLC0 citations61
US10806029B2Oct 13, 2020
Catalytic circuit board with traces and vias
CATLAM LLC0 citations51
US10765003B2Sep 1, 2020
Method for making a multi-layer circuit board using conductive paste with interposer layer
CATLAM LLC0 citations51
US10685931B2Jun 16, 2020
Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive
CATLAM LLC0 citations51
US10573610B2Feb 25, 2020
Method for wafer level packaging
CATLAM LLC0 citations41
SIERRA CIRCUITS INC
10 patentsUS9706650B1Jul 11, 2017
Catalytic laminate apparatus and method
SIERRA CIRCUITS INC15 citations92
US9922951B1Mar 20, 2018
Integrated circuit wafer integration with catalytic laminate or adhesive
SIERRA CIRCUITS INC7 citations83
US10849233B2Nov 24, 2020
Process for forming traces on a catalytic laminate
SIERRA CIRCUITS INC5 citations72
US10765012B2Sep 1, 2020
Process for printed circuit boards using backing foil
SIERRA CIRCUITS INC2 citations72
US10349520B2Jul 9, 2019
Multi-layer circuit board using interposer layer and conductive paste
SIERRA CIRCUITS INC1 citations62
US9942981B2Apr 10, 2018
Circuit board apparatus and method
SIERRA CIRCUITS INC1 citations62
US10827624B2Nov 3, 2020
Catalytic laminate with conductive traces formed during lamination
SIERRA CIRCUITS INC0 citations51
US10306756B2May 28, 2019
Circuit board with catalytic adhesive
SIERRA CIRCUITS INC0 citations51
US9706667B2Jul 11, 2017
Via in a printed circuit board
SIERRA CIRCUITS INC0 citations51
US9674967B2Jun 6, 2017
Via in a printed circuit board
SIERRA CIRCUITS INC1 citations51